Thought Leadership

Siemens EDA at the 59th Design Automation Conference

By Harry Foster

Mark your calendars for the upcoming 59th Design Automation Conference, and welcome back to the beautiful city by the bay—San Francisco! The 59th DAC will be held at the Moscone Center West from July 10-14, 2022. I have had the honored of serving as this year’s DAC Past Chair and working with the DAC executive committee I feel we have put together a remarkable technical program.

DAC has always been a unique event and this year is no exception. After all, DAC is the only event that brings together the entire design and automation ecosystem, which includes academic and industrial researchers, electronic executives and managers, IC and systems designers and developers, educators, and of course vendors.

For the 59th DAC, Siemens is a Platinum exhibitor, and our booth is located at #2521. In addition to our exhibits, Siemens EDA has 30 active participants in the technical program, which includes:

  • 1 SKYTalk (Short Keynote)
  • 1 Invited Engineering Track Talk
  • 10 Engineering Track Presentations
  • 4 Engineering Track Posters
  • 1 Research Track Work-in-Progress Poster

In this blog I plan to highlight a few of the key Siemens EDA DAC program events.

The first event I want to highlight is an invited SKYTalk (short keynote) given by Joe Sawicki, Executive Vice President IC EDA, Siemens. Joe’s talk, titled Delivering “Smarter” Faster: The Future of EDA & AI, will survey the substantial improvement reaped thus far from incorporating AI/ML into EDA toolsets. Joe’s talk is scheduled for Monday, July 11th at 1:00pm PST in the DAC Pavilion.

The second event I want to highlight is an invited Engineering Track talk by Bryan Rameriz, Director Industries, Solutions & Ecosystems, Siemens EDA​, and is titled Introduction to Digital Twins and the Intersection with Electronics​. This talk is part of the special invited session titled Digital Twin Reimagined – One Model To Rule Them All?, which is scheduled for Wednesday, July 13th at 3:30pm PST. This session focuses on the opportunities as well as the challenges of bringing together Digital Twin technologies with semiconductor, electronics HW and SW development techniques.

The third event I want to highlight is a tutorial titled Hardware/Software Co-design with High-Level Synthesis, which is scheduled for Monday, July 11th1:30pm PDT. Siemens EDA’s Sadhvi Praveen and Russell Klein will demonstrate today’s High-Level Synthesis transformation on an example algorithm from a full software implementation to a high performance, efficient implementation with a mix of hardware and software elements.

The following is a full listing of Siemens EDA technical participation within this year’s DAC program:

SKYTalkDelivering “Smarter” Faster: The Future of EDA & AI
Invited Engineering Track TalkDigital Twin Reimagined – One Model To Rule Them All ?
TutorialHardware/Software Co-design with High-Level Synthesis
Engineering TracksA hierarchical and tractable Mixed Signal verification methodology for first-generation Analog AI Processors
Engineering TracksCharacterization Challenges in System Level IO Interface
Engineering TracksCreating Robust EDA and IP Ecosystems to Strengthen the Global Semiconductor Supply Chain
Engineering TracksDesign for Manufacturability (DFM) for Analog IP
Engineering TracksMachine Learning and EDA: The Productivity Cycle
Engineering TracksEfficient use of on-line LogicBIST to achieve ASIL B in a GPU IP
Engineering TracksExperimental Validation of a Novel Methodology for Electromigration Assessment in On-chip Power Grids
Engineering TracksFrequency synthesizers with a purpose in advanced process technologies
Engineering TracksIntegrating Liberty model validation, analysis, and visualization as part of library design and characterization
Engineering TracksVariation-Aware Design Verification For Automotive Semiconductor IP
Engineering Track PosterA unified IP QA methodology to improve validation coverage and throughput
Engineering Track PosterAutomated DCAP and filler cell insertion with embedded Design for Inspection (DFI) Sensors
Engineering Track PosterChatbot as a Virtual Assistant to Retrieve Information from Datasheets
Engineering Track PosterImproving Power Grid IR drop with an automated layout enhancement flow
Work-in-Progress PosterWhat Helper Data Really Leaks: A Practical Approach to Estimate the Min-Entropy in PUFs Using Their Response Mass Function

You can learn more about Siemens EDA technical participation at this year’s DAC by visiting the online program. In addition, visit for a full listing of all events at this year’s 59th DAC!

Finally, check with Siemens Digital Industries Software Events to learn more about what is happening in the Siemens EDA booth!

Oh, and act now, free I LOVE DAC advance registration ends on June 10th, 2022! General advance registration also ends on July 10th, 2021.

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This article first appeared on the Siemens Digital Industries Software blog at