Learn how Tessent Multi-die software helps implement design-for-test structures for 2.5D and 3D designs. This video was recorded at the 2023 Design Automation Conference.
Learn how Broadcom used Tessent Multi-die to build a 3D IC flow in this video recorded at the 2023 North America U2U symposium.
Don’t miss the exciting lineup of Tessent Test and Embedded Analytics presentations at U2U North America on A[ril 13, 2023.
