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Innovator3D IC Integrator 2604.002: Faster pathfinding for advanced 3D IC and chiplet design

As advanced packaging and chiplet-based architectures continue to push design complexity higher, engineering teams need tools that move just as fast as their ideas. Innovator3D IC Integrator 2604.002 delivers exactly that: a new set of capabilities focused on accelerating pathfinding, simplifying prototyping, and improving handoff into implementation.

A standout enhancement in this release is the ability to forward annotate AI-generated or designer-created signal groups and signal flow paths directly into Innovator3D IC Layout. These prototype “sketched plans” give substrate designers a valuable head start, helping teams move more quickly from early architectural exploration to detailed routing.

The release also brings greater flexibility to layer stackup editing. Designers can insert layers above or below existing ones and define conductor resistivity and thickness properties for improved interconnect analysis, particularly in silicon interposer and bridge-based designs.

To support faster chiplet and ASIC planning, device pin and microbump arrays can now be generated from LEF/DEF data, creating streamlined black-box device representations without requiring internal macro or die RDL details. This makes early design exploration more efficient while preserving the information teams need most.

Additional workflow improvements reduce manual effort across the board. New commands enable rapid top-side and bottom-side pin renumbering, prototype cells can be swapped with approved central library cells during forward annotation, and Verilog export now supports configurable naming case to satisfy downstream EDA tool requirements.

With Innovator3D IC Integrator 2604.002, Siemens continues to help design teams shorten iteration cycles, reduce friction, and bring advanced 3D IC concepts to implementation with greater confidence.

For more detailed information you can download the release fact sheet.

Download and upgrade to 2604.0002 today by visiting the Siemens Support Center downloads area Downloads

Keith Felton

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This article first appeared on the Siemens Digital Industries Software blog at https://blogs.sw.siemens.com/semiconductor-packaging/2026/07/08/innovator3d-ic-integrator-2604-002-faster-pathfinding-for-advanced-3d-ic-and-chiplet-design/