Industry: Semiconductor Devices

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3D IC podcast Why traditional PCB methods fall short in 3D IC design

Why traditional PCB methods fall short in 3D IC design

June 12, 2025

Why are companies rapidly adopting fan-out wafer-level packaging (FO-WLP)—and how does this shift impact the traditional chip design process? In…

By Tova Levy
< 1 MIN READ

3D IC is here: But is your architecture ready for it?

May 29, 2025

As 3DIC adoption ramps up, it’s becoming clear: microarchitecture needs a rethink. So how do you design hardware that can…

By Tova Levy
2 MIN READ

The future of 3D ICs: How advanced packaging is changing the industry

May 15, 2025

How are 3D Integrated Circuits (3D ICs) revolutionizing semiconductor design, and what role do advanced packaging technologies play in this…

By Tova Levy
< 1 MIN READ

Ep 16 – EDA and the Shift-Left with Mike Ellow – Part 3

May 2, 2025

Today we are bringing you the third and final installment of our discussion with Mike Ellow, CEO of Siemens EDA….

By Conor Peick
< 1 MIN READ

Ep 13 – Evolving Digitalization in the Semiconductor Industry with Michael Munsey – Part 3

February 21, 2025

Welcome back to the Industry Forward Podcast with Dale Tutt! Today, we’re bringing you the final part of our discussion…

By Conor Peick
< 1 MIN READ

Ep 12 – Evolving Digitalization in the Semiconductor Industry with Michael Munsey – Part 2

February 7, 2025

The Industry Forward Podcast returns with the second part of our conversation with Michael Munsey, Vice President of the Semiconductor…

By Conor Peick
< 1 MIN READ

Ep 11 – Evolving Digitalization in the Semiconductor Industry with Michael Munsey – Part 1

January 24, 2025

In the latest episode of the Industry Forward Podcast, Dale and Conor begin an examination of the fascinating and immensely…

By Conor Peick
< 1 MIN READ
Digital Threads Engineer Innovation

Digital Threads in Semiconductor Engineering

September 4, 2024

In this episode of the Engineer Innovation Podcast, we dive into the rapidly evolving world of semiconductor technology with Siemens’ experts David Corey and Dr. Andras Vass-Varnai. From the economic limits of Moore’s Law to the rise of advanced packaging and the power of digital threads, we explore how the industry is navigating complex challenges. Tune in to discover how these innovations are shaping the future of high-performance electronics and manufacturing.

By Stephen Ferguson
2 MIN READ

Exploring the challenges and priorities of automotive cybersecurity

April 17, 2023

What’s the future of security for connected and autonomous vehicles? Tune in to hear Lee Harrison, the director of automotive IC solutions at Siemens EDA, and Siraj Shaikh, professor of systems security at Swansea University, discuss the challenges and priorities of automotive cybersecurity.

By Lee Harrison
< 1 MIN READ