3D InCites Podcast – Siemens’ AJ Incorvaia Explains the Evolution of EDA Tools for Advanced Packaging and 3D ICs
As part of our 3D IC podcast series, Siemens’ AJ Incorvaia, Sr. VP, Electronic Board Systems, EDA, sat down with Françoise von Trapp in a recent 3D InCites podcast to discuss the evolution of EDA tools for advanced packaging and 3D ICs including our newest software, Innovator3D IC.
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Listen in as they discuss the need for real-time 3D visualization and automation capabilities to enable the design and manufacturing of complex 3D ICs. They also highlight the growing importance of digital twin technology in the semiconductor industry and the challenges of designing and optimizing 3D ICs, including the need for concurrent design across multiple disciplines.
You’ll learn about:
- Evolution of semiconductor packaging from wire bond to heterogeneous integration and 3D stacking
- 3D IC design tools and their evolution
- Digital twins, chiplet architectures, and 3D integration processes in semiconductor design
- Innovator 3D IC – a new product ” for faster, more predictable chip design
- Siemens’ new 3D IC design platform for concurrent design and optimization.
- How design teams can take advantage of the digital twin and predictive analysis capabilities in Innovator 3D IC.
Now, with the movement to 2.5D and 3D designs, particularly with stacked die and interposers, it’s a whole new world, and there’s a whole new set of technologies that need to come online“
AJ Incorvaia, Sr. VP, Electronic Board Systems, EDA, Siemens
You’ll get some back-story on the evolution of chiplets and the importance of standardizing chiplet models and workflows for the chiplet ecosystem. You’ll also learn how Siemens’ new 3D IC design platform fits into their current 3D IC packaging technologies and workflows with enhanced capabilities, including an enhanced AI-infused user experience that accelerates 3D IC design.
Learn more about Innovator 3D IC
To learn more about how Siemens 3D IC heterogeneous semiconductor packaging solutions catapult design teams into the future of IC design visit our 3D IC Homepage
To learn about our semiconductor packaging design and verification solutions Click here.
3D IC
Three-dimensional integrated circuits take less space and deliver higher performance.
