Siemens Digital Industries Software Blog Network

Siemens Digital Industries Software Blogs


Verification Horizons

Part 2: The 2022 Wilson Research Group Functional Verification Study

In my previous blog, I present FPGA design trends identified in the 2022 Wilson Research Group Functional Verification Study to...

Semiconductor Packaging

Importance of early planning for interconnect verification in 3D IC physical design workflows

In our last podcast on 3D IC architecture workflows, we discussed how a system or microarchitectures determine how to partition...

Simcenter

Simulation for a fitter world

Can Simcenter help us to stay fitter and healthier? Read how simulation can help increase our performance in sports.

Valor

3 Creative Solutions for the Component Shortage Crisis

In the fourth of a series of WNIE podcasts, Zac Elliot – Technical Marketing Engineer at Siemens Digital Industries Software...

Tessent Solutions

How to master DFT for tile-based designs

Hierarchical designs that are tile-based or abutment based physical blocks are predominant in today’s chips. Having no logic present at the chip-level calls for new approaches to testing these tile-based architectures. How a design for test (DFT) architecture can support tile-based designs is the focus of this presentation from U2U 2022.

Tessent Solutions

Explore a new way to measure heterogenous SoC performance at the Linley Fall Processor Conference

Join Siemens at the Linley Fall Processor Conference, the two-day event focusing on processors and IP cores used in embedded, communications, automotive, IoT, and server designs.

Embedded Software

Using open source vs. commercial Linux

Using Linux in your medical device has plenty of advantages. A successful migration to embedded Linux can bring numerous advantages...

Partners

4 productivity killers in die design

Die shops across North America understand that their survival depends on their efficiency, especially when it comes to tooling design...

Tessent Solutions

Tessent at ISTFA 2022

Join Tessent at the 48th International Symposium for Testing and Failure Analysis, the premier event for the microelectronics failure analysis community.