Siemens Digital Industries Software Blog Network

Siemens Digital Industries Software Blogs


Valor DFM Solutions

What’s New in Valor NPI 2311

Each new Valor NPI release brings exciting features and improvements, and Valor NPI version 2311 is no different. One of the most prominent recent changes for release 2311 is the 3D board viewer. This allows users to toggle between the typical 2-D board view, and a 3-D board view. While less visually prominent, the addition of high-risk component detection is no less impactful among the overall improvements. The Valor Parts Library now associates individual components with a manufacturing risk value. This allows you to consider at-a-glance relative yield values based on component choices. Valor NPI version 2311 also facilitates the placement of XD components in a zigzag array.

Tessent Solutions

Three ways to slash AI chip TTM with advanced DFT and silicon bring-up

Advanced EDA technology eases AI chip development.

Teamcenter

New in Teamcenter Share: December 2023

The latest release of Teamcenter Share delivers several enhancements and new features designed to help users collaborate more efficiently, including an expanded roster of supported file types, increased integration with Siemens Xcelerator products, and much more.

Polarion

19. December: Holiday Risk Heat Map

A heat map at a glance will organize risk based off of severity and likelihood of the risk. This heat...

Thought Leadership

Industrial Machinery – a writer’s year in review for 2023 – pt. 2.

In continuing my reflection of the more notable industrial machinery blogs, articles, and podcasts of 2023, I begin by spotlighting...



Tecnomatix

Process Simulate Robot Safety in Production Systems [VIDEO]

Delve into the capabilities of Tecnomatix Process Simulate software, specifically Safety Robot Manager (SRM), and how it ensures comprehensive safety and efficient robotic design while validating concepts, visualizing secure spaces, and optimizing processes.

Semiconductor Packaging

System-level, post-layout electrical analysis for high-density advanced packaging (HDAP)

HDAP designs like FOWLP need post-layout simulation (analog) and post-layout STA (digital) flows to augment basic physical verification DRC and LVS.

Simcenter

Vibrated with confidence: a recap of Siemens' recent aircraft ground vibration testing masterclass

Missed out on the ground vibration testing (GVT) Europe Masterclass 2023? Read this blog to see the recap of this edition!


Siemens Xcelerator Academy

Empower your career journey: The Gift of Certification  

This is the season of giving, and this Christmas, Siemens Xcelerator Academy is unwrapping a special gift just for you:...