Siemens Digital Industries Software Blog Network

Siemens Digital Industries Software Blogs

Keeping Pace with Evolving Technologies: Why old tools and approaches are not enough

February 09, 2017

Technical and commercial media sources are constantly discussing how design safety and security has not kept pace with quickly evolving technologies. Pundits are pointing to issues with everything fr...

Embedded Software

Every color of the rainbow

February 09, 2017

What do you do when you see a rainbow? I will tell you what I do: I just stand and...

Electronic Systems Design

Correlation up to 50GHz

February 09, 2017

Last week I attended DesignCon, and as usual correlation between simulation and measurement was a hot topic, especially for the...

By Patrick Carrier

Solid Modeling vs. Surface Modeling - A New Way Forward

February 09, 2017

Solid modeling or surface modeling… this choice has plagued CAD designers and engineers since the dawn of 3D CAD software. Solid modeling was the preferred option for engineering, due to its mathemat...

Parasolid Communicator chosen by Verashape for 3D Printer Software

February 09, 2017

Verashape has become one of the latest companies in Additive Manufacturing to embrace Parasolid. The company supplies the VSHAPER line of 3D printers which are used across numerous ind...

NX Manufacturing TV

Additive Manufacturing and Machining - The integrated Siemens process chain in practice.

February 08, 2017

Siemens customer Hoedtke GmbH & Co. KG is one of the first manufacturing companies using an industry-standard Directed Energy Deposition (DED) overall solution -- from the CAD/CAE/CAM process (wi...

By Stephanie Aldrete

NX Manufacturing

Additive Manufacturing and Machining - The integrated Siemens process chain in practice.

February 08, 2017

Siemens customer Hoedtke GmbH & Co. KG is one of the first manufacturing companies using an industry-standard Directed Energy Deposition (DED) overall solution -- from the CAD/CAE/CAM process (wi...

By Danny Santoro

Electronic Systems Design

Designing PCB's for IoT - Part 1: IoT Everywhere

February 08, 2017

A recent IHS report forecasted that the IoT market will grow from an installed base of 15.4 billion devices in...

By John McMillan

Electronic Systems Design

Silicon Valley IC Packaging Seminar Validates Growing Proliferation of FOWLP

February 07, 2017

If you’re interested in High Density Advanced Packaging (HDAP), our recent, focused seminar at Mentor Graphics’ Fremont campus was the...

By Craig Armenti

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