Introducing PAC for Opcenter Execution Semiconductor: Connect, automate and scale factory operations

Introduction

Semiconductor manufacturing depends on automation. Connecting equipment, production systems and data across the factory is complex. Manufacturers may need to address manual data collection, machine and recipe control, closed-loop processes, or broader factory automation, while working with different equipment types, protocols and existing IT and OT environments.

PAC helps address this challenge by providing a scalable platform that connects equipment, systems and data to digitize, automate and orchestrate manufacturing operations.

The Foundation: Opcenter Execution Semiconductor

As explored throughout this four-part series, Opcenter Execution Semiconductor provides the digital foundation for managing complex semiconductor manufacturing operations. The series has looked at specialized capabilities that extend this foundation, from recipe management and substrate map management to factory job automation.

Now, in the fourth and final installment, we turn to the connection between the shop floor and manufacturing systems: PAC.

Introducing PAC

Connect equipment, systems and data

PAC is designed to integrate different equipment and services regardless of protocol or interface. Flexible adapters support common interfaces, while data-channeling capabilities help ensure that target systems receive the data they require.

By connecting the shop floor with MES, MOM and enterprise systems, PAC helps bridge the gap between data created at the machine level and the manufacturing systems that use it.

Centralize automation management

PAC integrates with existing IT and OT infrastructure while centralizing administration and monitoring in a single environment. Teams can manage machine integration, monitor production-related events and control deployed configurations across the factory.

Versioned instances and controlled updates are designed to support stable 24/7 operations across the production environment.

Improve visibility and traceability

PAC captures interactions and process data and can translate, transform, contextualize, aggregate and route events and data to the appropriate destinations. This creates a foundation for visibility and traceability that can support quality and compliance activities, troubleshooting and continuous improvement.

Deploy and scale with flexibility

Different manufacturers have different infrastructure strategies. PAC supports on-premises and cloud-based deployments as well as containerized environments, edge devices and industrial PCs.

For manufacturers looking for ready-to-use automation, PAC apps are also available through the Siemens Industrial Edge Marketplace, with prebuilt use cases and support for custom mappings.

Build and maintain automation in-house

PAC also gives manufacturers the option to create their own equipment integrations and automation logic. Training and enablement support this approach, allowing teams to retain critical automation know-how internally and make changes across distributed environments.

See PAC in action

Watch the video to see how PAC connects manufacturing equipment, systems and data, supports automation across IT and OT environments, and provides a scalable foundation for production automation.

PAC complements the capabilities explored throughout our semiconductor series, bringing the connection between equipment and manufacturing systems into the broader Opcenter Execution Semiconductor environment.

Complete the four-part series

PAC concludes our four-part series exploring capabilities that help semiconductor manufacturers connect, manage and automate increasingly complex production environments.

If you missed the earlier installments:

RMS: Recipe Management System: Centralized recipe management for semiconductor manufacturing.

MapSuite: Precision substrate map management.

MJAC: Manufacturing Job Automation Controller: Factory job orchestration and automation.