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Electronics & Semiconductors

At Siemens we see a symbiotic relationship between Semiconductors and Electronics that drives growth and innovation for both markets: Semiconductors, with their embedded intelligence delivered in rapidly shrinking form factors, representing a rising percent of the value of Electronics systems. Meanwhile, new and innovative categories of smart, connected products and devices are revolutionizing the electronics space, driving strong demand and affinity for innovative designs and products that deliver optimal convenience and entirely new consumer experiences. Design and manufacture of today’s complex products and semiconductor devices requires seamless collaboration across multiple domains including electrical, electronic, mechanical, simulation, software and data management.

Learn more about Siemens solutions for the electronics industry     Learn more about Siemens solutions for the semiconductor industry


Siemens Xcelerator Academy

Continuous Learning: Empowering Success in the Digital Era

December 13, 2023
As Heraclitus wisely observed “The only thing that remains constant is change.” Change is an inevitable part of life, influencing...
By Siemens Xcelerator Academy
3 MIN READ

Verification Horizons

IEEE Honors Siemens Employees for Dedication to Standards Development

December 12, 2023
Annually, the IEEE Standards Association (IEEE SA) recognizes outstanding participation across a variety of technical areas of standards development, leadership,...
By Tom Fitzpatrick
2 MIN READ


Simcenter

What’s new in Simcenter FLOEFD 2312? | CAD-embedded CFD simulation

December 11, 2023
Explore Simcenter FLOEFD 2312 CAD-embedded CFD software release that includes faster CFD meshing, PCB reflow oven simulation, Smart PCB modeling speed, structural mesh boolean operation (MB), a new API for simulation automation and much more
By Chris Watson, Peter Doughty
8 MIN READ

Semiconductor Packaging

Crossing the chasm: Bringing SoC and package verification together

December 08, 2023
3D IC package designers need assembly-level LVS for HDAP verification.
By John McMillan
2 MIN READ

Opcenter

What’s new in Opcenter Intelligence Cloud 2310

December 07, 2023
Enhancing manufacturing insights to improve trend analysis and decision-making Using Opcenter Intelligence Cloud enables you to connect, organize and aggregate...
By Alessandro Cereseto
2 MIN READ

Semiconductor Packaging

Package designers need assembly-level LVS for HDAP verification

December 05, 2023
While advanced integrated circuit (IC) packaging is a fast-growing market, comprehensive package verification still has a ways to go. Unique...
By John McMillan
2 MIN READ

Siemens Software Podcast Network

The future of smart machines and smart industries – ep. 3

December 05, 2023
Today we conclude our special three-part podcast from Siemens Digital Industries Software investigating how software and automation technologies will combine...
By Conor Peick
< 1 MIN READ

Electronic Systems Design

Strengthening PCB Solder Connections

December 05, 2023
To increasing the overall solder strength within a PCB design, designers should be focusing on two distinct but related factors: The material composition of the solder, and the pad and footprint layouts for individual components. The composition of the solder itself will depend upon the application of the board, the components, construction method and materials within the board, and the overall final board quality. The overall footprint of the component will be dependent upon the components within a BOM and the recommended assembly guidelines of your assemblers. Both of these factors rely on discussions and interactions with your assembly house and leaving these discussions until after the design has been released ultimately limits your assembly options.
By Patrick Hope
6 MIN READ

Tessent Solutions

Awarding excellence: Siemens’ James Pickford wins BrightSparks award

November 30, 2023
Siemens’ James Pickford wins BrightSparks award.
By Tessent Solutions
2 MIN READ

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