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Electronics & Semiconductors

At Siemens we see a symbiotic relationship between Semiconductors and Electronics that drives growth and innovation for both markets: Semiconductors, with their embedded intelligence delivered in rapidly shrinking form factors, representing a rising percent of the value of Electronics systems. Meanwhile, new and innovative categories of smart, connected products and devices are revolutionizing the electronics space, driving strong demand and affinity for innovative designs and products that deliver optimal convenience and entirely new consumer experiences. Design and manufacture of today’s complex products and semiconductor devices requires seamless collaboration across multiple domains including electrical, electronic, mechanical, simulation, software and data management.

Learn more about Siemens solutions for the electronics industry     Learn more about Siemens solutions for the semiconductor industry


Opcenter

Introducing a Game-Changing Webinar: Revolutionizing User Experience for Electronics Manufacturers

January 08, 2024
Are you tired of inefficiencies on your shop floor? Do you want to streamline your production processes and achieve continuous...
By Alessandro Cereseto
2 MIN READ

Aprisa

Let AI help with macro placement during place and route

January 03, 2024
Aprisa’s AI-driven Auto Macro Placement (AMP) creates a high-quality floorplan in a fraction of the time needed for manual macro placement.
By Aprisa DI
5 MIN READ

Semiconductor Packaging

Parasitic extraction technologies: Advanced node and 3D-IC design

January 02, 2024
Advanced nodes and 3D-IC packages require new and enhanced parasitic extraction processes that can resolve a variety of complex parasitic issues in these designs.
By John McMillan
3 MIN READ

Semiconductor Packaging

Impacts of 3D IC on the future

December 20, 2023
3D IC technology development started many years ago well before the slowing down of Moore’s law benefits became a topic...
By John McMillan
3 MIN READ

Electronic Systems Design

Adapt to Design - Design for manufacturing

December 20, 2023
Design for manufacturing, or DFM, is a crucial aspect of electronics manufacturing best practices. It emphasizes that each printed circuit...
By Paul Carpine
2 MIN READ

Electronic Systems Design

What’s New in Valor NPI 2311

December 19, 2023
Each new Valor NPI release brings exciting features and improvements, and Valor NPI version 2311 is no different. One of the most prominent recent changes for release 2311 is the 3D board viewer. This allows users to toggle between the typical 2-D board view, and a 3-D board view. While less visually prominent, the addition of high-risk component detection is no less impactful among the overall improvements. The Valor Parts Library now associates individual components with a manufacturing risk value. This allows you to consider at-a-glance relative yield values based on component choices. Valor NPI version 2311 also facilitates the placement of XD components in a zigzag array.
By Maya Shani
4 MIN READ

Tessent Solutions

Three ways to slash AI chip TTM with advanced DFT and silicon bring-up

December 19, 2023
Advanced EDA technology eases AI chip development.
By Lee Harrison
6 MIN READ

Semiconductor Packaging

System-level, post-layout electrical analysis for high-density advanced packaging (HDAP)

December 18, 2023
HDAP designs like FOWLP need post-layout simulation (analog) and post-layout STA (digital) flows to augment basic physical verification DRC and LVS.
By John McMillan
3 MIN READ

Thought Leadership

Looking back on 2023 – A writer’s perspective pt. 2

December 14, 2023
Leveling up from the more specific discussion from part 1 about the near-term challenges facing automotive and transportation companies, we...
By Conor Peick
3 MIN READ

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