Siemens combines the real and digital worlds to improve semiconductor fab performance

Fall Semiconductor Series: How integrated software and automation transform fab sustainability 

(Part 3 of 5): The semiconductor fab is a complex challenge—how do you know where your sustainability journey should begin? 

Connecting smart, secure and sustainable manufacturing processes across the fab

Fall Semiconductor Series: How integrated software and automation transform fab sustainability 

(Part 2 of 5): Why an integrated software and automation solution is the right solution 

semiconductor wafers with infinity loop

Fall Semiconductor Series: How integrated software and automation transform fab sustainability

(Part 1 of 5) Why does semiconductor fab sustainability require an integrated solution? In our Fall Semiconductor Series, we discuss…

Escaping the Oracle agile trap: Why Teamcenter Is your only path to digital transformation

Escaping the Oracle agile trap: Why Teamcenter Is your only path to digital transformation

Are you trapped in the Oracle Agile dilemma? If you’re managing product development with Oracle Agile, you’re facing a critical…

Speakers Gabriella Leone and Michael Munsey

Collaboration: The key to semiconductor industry growth and resilience | Executive strategy deep-dive- Part 1

In this two-part Q&A interview series, we sit down with Michael Munsey, Vice President of Semiconductors and Electronics at Siemens Digital Industries Software. Michael shares his insights on Siemens’ forward-thinking three-pillar strategy, designed to position the company as a key enabler of semiconductor industry growth through greater collaboration, software-driven innovation, and digital transformation.

VIrtual Repr

Pioneering the Future of Chips Manufacturing: Intel Foundry’s 10x Moonshot to Fully Autonomous Factories

What are the challenges in optimizing a semiconductor manufacturing enterprise with a smart manufacturing enabled software and automation solution? Let’s…

Semiconductor and electronics industry trends 2025: Expert analysis and market outlook

As we approach the end of 2024, I find myself reflecting on the remarkable transformation our industry has undergone. From…

The image shows a person in a protective white full-body suit, including a hood and mask, holding a green silicon wafer with etched patterns in what appears to be a high-tech manufacturing facility or cleanroom environment. The background is slightly blurred, but displays a futuristic-looking interior space with bright overhead lighting. The image's focus and composition highlights the worker inspecting or presenting the silicon wafer, which is a key component used in semiconductor and microchip production.

Chip production and design with 3D IC technology

At Siemens, we recognize the potential of 3DIC to remove the limits and revolutionize semiconductor design and manufacturing. Our comprehensive portfolio of software and services provides the key enabling technologies for 3DIC adoption.

Streamlining BOM management and product configuration in the cloud

The world of electronics product development is evolving at a rapid pace. As products become more complex and teams become…