Log in
Skip to content

Main Navigation

Blogs
  • Products
    • All Products
    • Additive Manufacturing Software
    • Aprisa
    • Capital
    • Catchbook
    • Custom IC
    • Design with Calibre
    • Digital Logistics
    • EDA Consulting Services
    • Electronic Systems Design
    • Fibersim
    • Hardware Assisted Verification
    • HLS Design & Verification Blog
    • Insights Hub
    • JT
    • Mendix
    • NX Design
    • NX Industrial Electrical Design
    • NX Manufacturing
    • Opcenter
    • Pave360
    • PLM Components
    • Polarion
    • Questa
    • Semiconductor Packaging
    • Service Lifecycle Management
    • Simcenter
    • Solid Edge
    • Teamcenter
    • Teamcenter Manufacturing
    • Tecnomatix
    • Tessent Solutions
    • Valor
    • Zel X
  • Industries
    • All Industries
    • Aerospace & Defense
    • Automotive & Transportation
    • Consumer Products & Retail
    • Electronics & Semiconductors
    • Energy & Utilities
    • Heavy Equipment
    • Industrial Machinery
    • Marine
    • Medical Devices & Pharmaceuticals
  • Podcasts
    • All Podcasts
    • 3D IC
    • Additive Manufacturing Podcast
    • AI Spectrum
    • Bugged Out
    • Cloud Talk Today
    • Digital Powers Flexible: Consumer Products Podcast
    • Digital Transformation Podcast
    • Empowering Engineering Educators
    • Energy Transformation Podcast
    • Engineer Innovation Podcast
    • Engineering the Future Workforce
    • Model Based Matters
    • Next Generation Design Podcast
    • On the Move: A Siemens Automotive Podcast
    • Pioneers: Startups from Dreams to Reality
    • Printed Circuit Podcast
    • Security by Design
    • Talking Aerospace Today Podcast
    • The Battery Podcast
    • The Digital Dig - A Siemens Heavy Equipment Podcast
    • The Industry Forward Podcast with Dale Tutt
    • The Marine Industry Podcast Series
    • The Voice of Smart Digital Manufacturing Podcast
    • Where Today Meets Tomorrow Podcast
    • German only Podcasts
    • Machinenbau Talk
  • Thought Leadership
    • All Thought Leadership
    • Digital Transformation
    • Embedded Software
    • Expert Insights
    • Simulating the Real World
    • The Art of the Possible
    • Thought Leadership
    • Verification Horizons
  • Corporate
    • All Corporate
    • Academic and Future Workforce
    • AWS Partnership
    • Corporate Blog
    • Cre8Ventures (Siemens EDA)
    • EDA Support Blogs
    • Employee Spotlight
    • Partners
    • Realize LIVE
    • Siemens Xcelerator Academy
    • Siemens Xcelerator Software for Industry
    • Small & Medium Business
    • Xcelerator for Startups Videos
  • Community
  1. Home
  2. Products

stackup design

Filter by:
  • Featured
  • Customer Success Story
  • eBook
  • Events
  • Learning Resources
  • News
  • PCB
  • Podcast
  • Product Updates
  • Tips & Tricks
  • Video
  • Webinar
dielectric material loss

Cutting your losses – loss planning and you

October 9, 2025

Loss planning – What is the best laminate for a loss budget of x dB for y inches?  I was thinking in terms of Panasonic Megaton (sic) 6 or something like it.

By Bill Hargin
6 MIN READ
What's new Z-planner Enterprise 2504

What’s new in Z-planner Enterprise 2504

August 4, 2025

Z-planner Enterprise 2504 release The latest 2504 release of Z-planner Enterprise delivers powerful updates that streamline stackup planning, improve rigid-flex…

By Patrick Hope
3 MIN READ
What's new in z-planner 2024.1

What’s new in Z-planner Enterprise 2409 – stackup design wizard, impedance, compare stackups, DFSI

September 30, 2024

What’s new in version 2024.1 of Z-planner Enterprise including information on the enhanced stackup design wizard, impedance tab, compare stackups, improved import/export, DFSI and more

By Patrick Hope
4 MIN READ
PCB stackup

On-demand webinar: PCB Stackup Planning

September 14, 2021

See how material choices can make or break your design, and how to compare materials not just for the technical match, but for selecting the best material at the best value. You will also learn how today’s (and tomorrow’s) high speed circuits have brought new considerations into stackup design such as copper surface roughness and glass-weave skew.

By Mark Forbes
< 1 MIN READ