ECAD/MCAD collaboration is no longer optional — it’s survival 

In this episode of the Printed Circuit Podcast, host Steph Chavez welcomes two long-time friends and PCB design veterans —…

Design for Test

ASTER Technologies strengthens Siemens digital thread for optimized PCB manufacturability

Siemens EDA is pleased to announce its acquisition of ASTER Technologies, a trusted name within the PCB design industry with more than…

Design smarter, not harder: Evolving design reuse methodologies in EDA

In this episode of the Printed Circuit Podcast, host Steph Chavez explores the growing impact of design reuse in electronic design automation (EDA),…

what's new in Z-planner 2510

What’s new in Z-planner Enterprise 2510

The Z-planner Enterprise 2510 release of Z-planner continues to refine the product by focusing on simulation accuracy, overall ease of use and collaboration.

copper thickness in PCBs

Copper thickness: Closing the knowledge gap to design success

Copper thickness determination of rolled and electro-deposited (ED) copper foil by weight provides far more accuracy than contact-thickness gauges. Since the topography of treated foil varies greatly, and since the density of copper is known, weighing a 1-by-1 foot sheet is the best way to determine the average thickness of a sheet of copper.  So formally, the unit that we refer to as “ounces” is actually ounces per square foot.

What's new in Valor NPI 2504

What’s new in Valor NPI 2504

The latest Valor NPI 2504 release delivers powerful enhancements that make your Design for Manufacturing (DFM) analysis faster, more intelligent,…

Automated DFM in electronics manufacturing

Navigating the Transition to Automated DFM Solutions in Automotive Electronics

In the fast-paced world of automotive electronics, staying ahead of the curve is essential. With the rapid advancements in technology…

Crosstalk along traces

Your #1 defense against a crosstalk crisis

It’s been some time since I’ve seen an article on crosstalk, so I decided to take the opportunity to walk…

Close up of components on a PCB

Progressive verification: A 3-step approach to post-layout signal integrity analysis

Progressive verification prioritizes analysis based on their ease of completion. It focuses on getting the simple stuff out of the way as quickly as possible, tackling those big problems that can be identified quickly first and then sifting through progressively finer and more granular issues for better signal integrity.