It’s okay to BRAG! The PCB Technology Leadership Awards Are Here!

By John McMillan

We’ve all dealt with one of “those” designs. You know, that design with the unrealistic schedule or the impossible to satisfy constraints or a density that would challenge even the most seasoned design team. Sure the team felt a great sense of accomplishment when the design was completed and the first prototypes were assembled and powered up, but wouldn’t it be great to also let your peers in the industry know about the achievement? Well here’s your chance! The 27th annual PCB Technology Leadership Awards (TLA) opens for entries beginning April 17.

Started in 1988, this program is the longest running competition of its kind in the EDA industry. In fact it is the industry’s only award where design teams using Mentor’s solutions receive recognition by an independent panel of experts for overcoming the most extreme challenges facing PCB design teams today. Just look at the winning designs from previous years to get a sense of the types of technologies and industry segments that are represented in this program. This year, entrants will be able to submit their design accomplishments in any of seven categories:

  • Computers, blade and servers, memory systems
  • Consumer electronics and handheld
  • Industrial control, instrumentation, security and medical
  • Military and aerospace
  • Semiconductor packaging
  • Telecom, network controllers, line cards
  • Transportation and automotive

Winning teams receive global recognition through a press release along with being featured in presentations and webinars. The winning entries may also be featured in industry publications. I’m sure you have questions like who are the judges this year, what is the judging criteria, what type of information needs to be supplied, and who has access to the design information.  For answers to all of these questions and to submit your design entry (or multiple entries), simply visit the 27th Technology Leadership Awards entry portal.

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This article first appeared on the Siemens Digital Industries Software blog at