Behind the Design: Visteon®

This is the twelfth post in a series showcasing the winners of the 2014 Technology Leadership Awards. View the previous ones here.

First place winner in the Transportation & Automotive category: Visteon, United States.

Visteon_Logo

Design: automotive heads-up display

Design team: Hai Pham, Padmanaban Kanagaraj, and Krzysztof Russa

Design challenges:

  • BGA connections
  • The connections between 0.80 mm pitch BGA microprocessor 624 pin 25 X 25, two DDR3 96 pin 16 X 16, one Flash 1 mm pitch 64 pin 8 X 8 and the 30 pin double side edge connector proved to be very challenging. The requirements were to place the traces in close proximity in order to minimize trace length. Utilizing Constraint Manager allowed the requirements to be met while complying with all design rules for performance and fabrication.
  • Through-hole vias used for cost; challenging to route to BGA.
  • Mechanical: keepouts for slots, holes, and metal contact with housing
  • Power management: eight power rails to microprocessor; decoupling requirements

Visteon_Award_Winning_Design

 

Design tools and team comments:

  • Xpedition® Enterprise
  • Constraint Manager: Multiple net classes to manage signal integrity, EMI constraints
  • Hyperlynx PI was used to analyze decoupling capacitance for each group of circuits, such as power and GND plane areas, as well as the proximity of decoupling capacitors to the IC, and the number of vias and capacitors used.
  • Hyperlynx SI was used to measure and analyze circuit delay, cross talk, and impedance.
  • Hyperlynx Thermal was used to analyze component temperature and over PCB temperature to ensure the design met requirements.

Judges’ comments:

  • Excellent example of high-speed, higher-than-average density design using the latest design simulation and tools for new innovative features in autos.
  • This board was designed using standard layout technology. Tight interconnections to meet electrical requirements were compounded by strict mechanical limitations. Good description of what they went through to complete this design.

About the Technology Leadership Awards

Started in 1988, this program is the longest running competition of its kind in the electronic design automation (EDA) industry. It recognizes engineers and designers who use innovative methods and design tools to address today’s complex PCB systems design challenges and produce industry-leading products. See the full list of 2014 winners here.

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This article first appeared on the Siemens Digital Industries Software blog at https://blogs.sw.siemens.com/electronic-systems-design/2015/06/22/behind-the-design-visteon/