BGAs – CAD Library Series: Part 3

By John McMillan

In part 3 of this a 4 part whitepaper series dedicated to CAD library quality, we’ll describe each aspect to consider when creating BGA (Ball Grid Array) component library parts. It also describes the impact each feature has in the PCB process.




The BGA component family includes both collapsing and non-collapsing balls. This paper discusses everything from the land sizes for both ball types to the placement courtyard to consider for different technology and density levels.

WP pageClick here to access the BGA Whitepaper now.

You can download Part 1 of this white paper series dedicated to the creation of Molded Body components by Clicking here and Part 2 that covers the  Small Outline Transistor (SOT)  components.

To learn more about the xDM Land Pattern Creator Click here

And to learn more about Library Management, Click here!


Thanks for reading,  and be on the lookout for Part #4: QFP Components soon!


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This article first appeared on the Siemens Digital Industries Software blog at