In part 3 of this a 4 part whitepaper series dedicated to CAD library quality, we’ll describe each aspect to consider when creating BGA (Ball Grid Array) component library parts. It also describes the impact each feature has in the PCB process.
The BGA component family includes both collapsing and non-collapsing balls. This paper discusses everything from the land sizes for both ball types to the placement courtyard to consider for different technology and density levels.
Click here to access the BGA Whitepaper now.
To learn more about the xDM Land Pattern Creator Click here
And to learn more about Library Management, Click here!
Thanks for reading, and be on the lookout for Part #4: QFP Components soon!