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Siemens’ Solido Custom IC and TSMC Collaborate to Enable Advanced Process Node Verification

May 13, 2025

After an extensive qualification process, Analog FastSPICE (AFS), part of Solido Simulation Suite, has achieved certification for TSMC’s N2P and A16 process nodes. Solido SPICE also achieved qualification for these technology nodes, meeting TSMC’s accuracy requirements.

By Emma-Jane Crozier
2 MIN READ

How AI-powered EDA solutions help design and verify library IP for SoCs

August 29, 2023

Note: If you’re interested in knowing more about the Solido Library IP Solution, check out our on-demand webinar about optimizing…

By Wei-Lii Tan
2 MIN READ

Discussing Custom IC Verification with Taiwan Semiconductor Community

July 14, 2023

Taiwan is an inspiration to many countries that aspire to build or expand their semiconductor ecosystem. Although a small nation,…

By Pradeep Thiagarajan
3 MIN READ

Highlights from AWS Re: Invent 2022 – Siemens and AWS collaboration for “you dream it, we make it”

December 23, 2022

Source: AWS Re:Invent 2022 A fortnight ago, over 50,000 technologists and business leaders joined AWS for their annual gathering of…

By Nebabie Kebebew
3 MIN READ