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Product: Calibre

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EDA AI panel at the 2025 Siemens EDA User2User conference in Santa Clara, CA. Panelists (from left to right): Ting Ku (Nvidia), Ken Dyer (Microsoft), Karan Singh (AWS), Andrew Ross (AMD), Dan Yu (Siemens EDA), and Jeff Dyck (Siemens EDA).

Blueprint for Achieving Excellence in EDA using AI: Industry Experts Weigh In

June 10, 2025

This engaging Siemens EDA panel on AI implementation highlighted several key points: AI will enhance human expertise in EDA; while rich EDA data is crucial, it also poses challenges; robust compute infrastructure is essential for AI-driven EDA systems; and the adoption of AI should be swift yet stable

By Niranjan Sitapure, PhD.
3 MIN READ

Another breakthrough in Semiconductor Industry engineered by Intel Foundry

May 21, 2024

Ever since I got my first computer, I eagerly anticipated the announcement of each new Pentium processor from Intel. These…

By Lih-Jen Hou
3 MIN READ

Next-generation RF, ESD and IO designs on display at TSMC 2023 OIP Ecosystem Forum

September 8, 2023

TSMC 2023 Open Innovation Platform® Ecosystem Forum is taking a world stage in North America, Europe, Taiwan, China, Israel and…

By Pradeep Thiagarajan
3 MIN READ

eTopus and Siemens partner on advanced transceivers taking mainstage at TSMC OIP 2022

November 6, 2022

Thanks to TSMC’s initiative and organization, their 2022 North America OIP (Open Innovation Platform) Ecosystem Forum at Santa Clara convention…

By Pradeep Thiagarajan
3 MIN READ