Microchip’s journey to accelerated verification with Solido Additive Learning

Microchip leverages Solido Additive Learning’s AI-driven approach to accelerate iterative variation-aware verification by 3x to 20x, reducing re-verification cycles from weeks to hours.

Accelerating design innovation through scalable computing with cloud-ready Solido Simulation Suite on Amazon Web Services

Solido Simulation Suite on Amazon Web Services offers a cloud-ready solution to tackle the growing complexity of chip design by providing scalable, on-demand compute resources for efficient circuit simulation.

Multi-die verification and the chiplet simulation challenge

Multi-die verification: the chiplet simulation challenge

When multiple dies, potentially from different vendors and different process nodes, come together in a single package, traditional simulation approaches fall short.

Quantum semiconductor research forges ahead with steady breakthroughs

Quantum computing is an emerging technology Quantum computing promises a new generation of high-performance computers, with a completely novel approach…

World tour of CICV solutions continues to build semiconductor partnerships

Disruptions create difficult challenges, but it provides inspiration to create new solutions. Partnerships further accelerate the process by instilling confidence…

Semiconductor renaissance in the making

As the new year ushers in, so do resolutions for change requiring strategic planning. Converting visionary intentions into effective execution…

eTopus and Siemens partner on advanced transceivers taking mainstage at TSMC OIP 2022

Thanks to TSMC’s initiative and organization, their 2022 North America OIP (Open Innovation Platform) Ecosystem Forum at Santa Clara convention…