Solido Design Environment: A Solution for Variation-Aware and High Sigma Verification Challenges

In electronic design, staying ahead of the curve and utilizing cutting-edge tools for success is crucial. We’re excited to announce…

Tessent Multi-Die: The Era of 3DIC

In the ever-evolving world of technology, the drive to achieve higher performance, greater efficiency, miniaturization, and cost-effectiveness in the realm…

Beat the Heat: Essential Backup Strategies for Your Xpedition Designer Projects

In the sweltering heat of summer, just as you wouldn’t venture out without sunscreen, your Xpedition Designer projects shouldn’t be…

Level 2 Certification Release Announcement. In Memory of Chris Spear

Elevate Your Skills with Education Reach for the Stars with Siemens EDA Level 2 Certification Badges! We have some exciting…

HyperLynx Helps You Turn the Traffic Light Green for Your PCB Power Delivery Network (PDN)

As IC components continue to advance, the power requirements set by vendors are becoming more stringent. These requirements manifest as…

Enhance your User2User conference experience! Sign up for a training session the day before U2U Silicon Valley. Receive a free Siemens EDA ODT subscription. Keep on learning all year long.

User conferences are a great way to network and learn from your peers.  This year, for the first time, we are…

Enhance Test Time and Quality with Tessent Hybrid TestKompress/LogicBIST

As a Tessent user, you’re probably familiar with Tessent TestKompress and Tessent LBIST (logic built-in self-test) for Logic BIST insertion….

How to Master the Game of Setting Rules: Delay Formulas

In the third blog of our series, “How to Master the Game of Setting Rules: Constraint Manager”, we unleash the…

AI to the rescue: Pull off the covers, step out of that closet. Content localization made easy

Today, we are extremely proud & excited to announce the “First-to-EDA” AI-Powered Internationalization of Education (AI-PIE) project release. The result…