Solido Design Environment: A Solution for Variation-Aware and High Sigma Verification Challenges

In electronic design, staying ahead of the curve and utilizing cutting-edge tools for success is crucial. We’re excited to announce…

Tessent Multi-Die: The Era of 3DIC

In the ever-evolving world of technology, the drive to achieve higher performance, greater efficiency, miniaturization, and cost-effectiveness in the realm…

Beat the Heat: Essential Backup Strategies for Your Xpedition Designer Projects

In the sweltering heat of summer, just as you wouldn’t venture out without sunscreen, your Xpedition Designer projects shouldn’t be…

Level 2 Certification Release Announcement. In Memory of Chris Spear

Elevate Your Skills with Education Reach for the Stars with Siemens EDA Level 2 Certification Badges! We have some exciting…

Enhance your User2User conference experience! Sign up for a training session the day before U2U Silicon Valley. Receive a free Siemens EDA ODT subscription. Keep on learning all year long.

User conferences are a great way to network and learn from your peers.  This year, for the first time, we are…

Enhance Test Time and Quality with Tessent Hybrid TestKompress/LogicBIST

As a Tessent user, you’re probably familiar with Tessent TestKompress and Tessent LBIST (logic built-in self-test) for Logic BIST insertion….

How to Master the Game of Setting Rules: Delay Formulas

In the third blog of our series, “How to Master the Game of Setting Rules: Constraint Manager”, we unleash the…

Symphony Pro Mixed-Signal Solution: Mixed-Signal Verification and Debug Made Simple

The increasing complexity of mixed-signal systems-on-chip (SoCs) puts design verification challenges. To address these challenges, Siemens EDA offers SymphonyTM Pro…

Say Goodbye to Messy Designs: Flat vs. Hierarchical Design Methodology

Most people are familiar with Flat Designs, it is usually a single schematic sheet that includes the entire circuit, and…