Technology meets quality: from PCB design to electronics manufacturing excellence
Join Siemens and GÖPEL electronic at Test Convention 2026
In today’s electronics manufacturing landscape, quality and efficiency are no longer achieved through isolated tools or disconnected processes. Real success depends on how well PCB design, bill of materials (BOM), manufacturing process planning, and inspection and test are connected across the entire design‑to‑production flow.
This is exactly the focus of Test Convention 2026, organized by GÖPEL electronic with active participation from Siemens, taking place on April 22–23, 2026, in Jena, Germany.
Under the theme “Technology Meets Quality,” the event brings together experts in printed circuit board design, process engineering, and electronics manufacturing to explore how modern test, inspection, and digital manufacturing approaches improve real production outcomes.
Why Test Convention matters
Test Convention has become a key industry event for professionals responsible for turning design intent into reliable, high‑quality products. The agenda focuses on practical, production‑driven challenges, including:
- Improving manufacturing efficiency by connecting design, process planning, and production
- Reducing rework and scrap through better manufacturing process planning
- Strengthening quality with advanced inspection and test strategies
Rather than abstract theory, the event emphasizes real use cases, live demonstrations, and hands‑on experience.
Hands‑On Insight: from design to production
A core strength of Test Convention is its strong link between design and manufacturing execution. Participants will experience hands‑on workshops hosted directly at the GÖPEL electronic factory, covering topics such as JTAG / Boundary Scan, automated optical inspection (AOI / AXI), data integration, and inspection optimization.
Live demonstrations will show how inspection and test technologies support modern electronics manufacturing processes, while practical discussions address how to shorten the path from PCB design to production.
Digital Twin and process optimization
A recurring theme throughout the event is the growing role of digital twin concepts in electronics manufacturing. By combining production data, inspection results, and process knowledge, manufacturers can simulate and optimize the manufacturing process before physical production, improve first‑pass yield, and increase transparency across design, process planning, and execution.
Join Us in Jena
If your goal is to improve quality, efficiency, and collaboration across electronics manufacturing, from PCB design and BOM management to manufacturing process execution, Test Convention 2026 offers two days of focused learning, practical insight, and industry exchange.
👉 Learn more and register at www.testconvention.com
