Process Preparation X with SaaS and AI – The Ultimate NPI Solution for Electronics Manufacturing
What is Siemens Xcelerator?
Siemens Xcelerator is revolutionizing how businesses embrace digital transformation and sustainability. It’s a dynamic ecosystem of connected hardware, software, and services, designed to drive efficiency, flexibility, and innovation in manufacturing.
Siemens is shifting from a product-centric approach to a customer-first mindset, focusing on:
Seamless communication and user experience Integrated, AI-driven solutions rather than fragmented tools Stronger ecosystem collaboration to drive innovation Open, cybersecure APIs for effortless integration
With Siemens Xcelerator, we’re not just building solutions – we’re shaping the future of manufacturing.
AI-Powered Innovation at Siemens
Artificial intelligence is a strategic priority across the Siemens Xcelerator portfolio. We leverage AI to enhance:
Process automation and optimization
Search, discovery, and data analysis
User productivity and intelligent UX
Siemens is continuously evolving its AI tech stack, collaborating with OpenAI, Microsoft, and AWS to bring cutting-edge AI capabilities to electronics manufacturing.
AI-Powered PCB Layer Recognition: Process Preparation X Smart Layer Stackup
Traditional PCB process engineering requires manual PCB layer classification, which is both time-consuming and error-prone. Engineers must carefully define PCB layers from non-intelligent data formats like Gerber files, increasing the risk of costly mistakes.
The Solution? AI-powered PCB layer classification.
Siemens’ Intelligent AI PCB Layer Classification System automates PCB layer detection, eliminating human errors and dramatically accelerating the process.
Key Benefits of AI in PCB Layer Recognition:
Automated PCB layer identification – Faster and more reliable than manual methods Higher accuracy – Reduced risk of errors and costly delays Improved productivity – Engineers spend less time on manual classification Shortened learning curve – AI simplifies onboarding for new team members
By leveraging AI-powered PCB layer classification systems, manufacturers can streamline their NPI workflows, optimize production efficiency, and reduce time-to-market.
Process Preparation X – AI Co-Pilot for NPI Acceleration
One of the biggest challenges in New Product Introduction (NPI) is the pressure to bring innovative electronics to market faster. Traditional NPI workflows are often slow, manual, and resource-intensive.
How Siemens’ AI Co-Pilot Transforms NPI
With Process Preparation X (PPX) AI Co-Pilot, companies can:
Reduce manual effort – AI automates key steps in PCB data preparation
Speed up NPI workflows – Faster time-to-market for electronic products
Boost productivity – Engineers focus on value-added tasks, not repetitive processes
Simplify onboarding – AI-powered guidance helps new users get up to speed faster
PPX’s AI-driven automation ensures that electronics manufacturers stay competitive, efficient, and future-ready.
Why Siemens?
Siemens Process Preparation X solutions set the gold standard for PCB manufacturing and electronics assembly. Now, with new pricing and packaging, our scalable solutions are more accessible than ever—whether you’re a single-factory PCB assembler or a global EMS provider.
Don’t Miss Out!
Join us at EPP InnovationsFORUM+ on April 9, 2025, in Filderhalle Leinfelden-Echterdingen, Germany.
Hear us speak about AI in Process Preparation X!
Schedule a meeting with our experts
