Siemens Digital Industries Software Blogs

Etching inner layers involves cleaning the copper on both sides of the piece of laminate, applying a photoresist, exposing the photoresist to create the inner layer pattern, developing the resist, etching away the unwanted copper, and removing the etch resist. This process is automated in most shops and the chemistry is automatically monitored. As a result, the accuracy and repeatability is quite good. It is possible to etch inner layer traces using this process to an accuracy of ±0.5 mils. This accuracy control helps keep impedance within the tolerances required for transmission lines.

Harry Foster talks with Chandu Challapalli, Senior Management Director at Siemens EDA, about why timing constraints must be treated as first-class verification assets.

Designing a global supply chain requires balancing cost, service levels, resilience and sustainability. For BSH Home Appliances Group (BSH), achieving...

You are likely here because thermal issues have become the primary constraint shaping your 3D IC design decisions. As 3D integration pushes more performance into smaller footprints, thermal...

Learn three ways your businesses can use digitalization and simulation to drive dramatic improvements in your engineering efficiency and operations.

HyperLynx Design Space Exploration can help you optimize your design’s performance by exploring a very large design space in a fraction of the time required with traditional methods.

Chip design is one of the most complex and challenging tasks in the world, requiring specialized tools and knowledge far...

At the start of a new year, it’s the perfect time to look back at the standout Capital electrical system...

How can engineers delivery highly customized, flexible machines faster and more cost-effectively than they have in the past? And how...