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Siemens Digital Industries Software Blogs
Semiconductor Packaging
Ensure 3D IC Multiphysics Reliability for AI Systems at Scale
January 18, 2026
Every new generation of AI systems pushes SoC design teams closer to the end of Moore’s Law. The core question...
By Tova Levy
6
MIN READ
Thought Leadership
Building a framework for AI assisted engineering
January 16, 2026
Artificial intelligence is here to stay, with agentic AI being the latest addition to the roster of AI technologies that...
By Spencer Acain
3
MIN READ
Thought Leadership
Industrial machinery and AI – Episode 5 transcript
January 16, 2026
Chris Pennington: Hi, everyone. Welcome back to the Siemens Digital Industry Transformation podcast series. I’m your host. As always, I’m...
By Bianca Ward
7
MIN READ
Consumer Products & Retail
How much more could product teams accomplish if they stopped starting from scratch?
January 15, 2026
Product development teams in consumer packaged goods are under constant pressure to move faster. New SKUs. New formulations. Packaging updates. Regulatory changes that...
By Tyler Newcombe
3
MIN READ
Academic and Future Workforce
Why engineering student competitions are worth it
January 15, 2026
Discover the top benefits of engineering student competitions, from practical experience and career-ready skills to networking and more.
By Ian Mark
5
MIN READ
Designcenter
Designcenter NX | How to | Creating Technical Drawings
January 15, 2026
In our latest Designcenter™ NX™ software Tips and Tricks video we dive into the complete process of creating technical drawings....
By Jimmy Costello
5
MIN READ
Academic and Future Workforce
What are engineering student competitions?
January 15, 2026
Learn how these hands-on, team-based challenges work and how students apply engineering skills beyond the classroom.
By Ian Mark
4
MIN READ
Semiconductor Packaging
What Lies Ahead for System-Technology Co-Optimization (STCO) in 2026
January 15, 2026
The race to build ever more powerful and energy-efficient AI chips has been underway for years, but 2026 is shaping...
By Per Viklund
5
MIN READ
Semiconductor Packaging
AI is reshaping the 3D IC design ecosystem: Key trends to watch in 2026
January 15, 2026
Headlines on how the global AI race leads to the shortages of GPUs are in no short supply. Behind those...
By Sudarshan Deo
4
MIN READ
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Latest podcast episodes
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Inside humanoid robotics: software and semiconductors
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The Industry Forward Podcast
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The rise of software-defined vehicles in the automotive industry has opened new ways to access and leverage data gathered by...
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Can we bring manufacturing back to American cities? Haddy CEO and co-founder Jay Rogers thinks so. In this episode of...
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