Siemens Digital Industries Software Blog Network

Siemens Digital Industries Software Blogs


Thought Leadership

Topics in AI Systems: Part III — GNN+LLM Architecture and Implementation Patterns

In Part I of this series, we explored why fusing Graph Neural Networks (GNNs) and Large Language Models (LLMs) is...

Verification Horizons

Siemens at DVCon U.S. 2026

DVCon U.S. returns to a larger venue at the Hyatt Regency Santa Clara. The expanded rooms and exhibit hall are intended to support a program heavily focused on AI in verification. Siemens EDA will have a significant presence throughout the week. This includes a sponsored luncheon panel, a major conference keynote, technical papers, and multiple tutorials that advance the state of verification, agentic AI, CDC and RDC standardization, and HLS to FPGA cloud prototyping.

Custom IC

How Analogix utilized Solido SPICE to overcome verification challenges in creating high-quality PLLs

Analogix Semiconductor is a global provider of mixed-signal semiconductors, committed to advancing display quality on mobile devices while maximizing battery...

Custom IC

How Symphony Pro is defining the future of mixed-signal verification for high-speed die-to-die interfaces: A case study by AnalogPort

A modern chiplet interface contains millions of transistors, thousands of control signals, and dozens of ultra-sensitive analog blocks, all of...

Thought Leadership

Topics in AI Systems: Part II — GNN and LLM Types

In Part I, we introduced the idea that solving complex digital-engineering problems requires combining structural reasoning (GNNs) with semantic understanding...

Thought Leadership

Developing an AI enhanced chip design process Podcast - Transcript

If the only constant is change, then AI represents the next big change for many tools and industries. High-level synthesis,...

Insights Hub

How Insights Hub helps Envetec drive sustainable operations through actionable machine data

In healthcare and life sciences, single use plastics are unavoidable, but the landfill outcome doesn’t have to be. That’s the...

Semiconductor Packaging

The smart path to STCO with Hierarchical Device Planning (HDP)

Siemens partnered with Intel Foundry to develop a STCO centric capability that enables a “smart path” to homogeneous disaggregation using Hierarchical Device Planning and parameterized pin regions.

Thought Leadership

Why OEMs must increase simulation adoption

Efficiency in manufacturing is key to ensuring competitiveness for years to come. Manufacturers around the world work to tackle labor...