Siemens Digital Industries Software Blog Network

Siemens Digital Industries Software Blogs

Semiconductor Packaging

What's new in Innovator3D IC 2604

This latest Innovator3D IC release brings a raft of design capability and productivity enhancements to the product family, further enabling its ability to design for the latest AI and Hyperscaler devices using advanced heterogeneous integration platforms.

By Keith Felton

NEW RELEASE: Simcenter HEEDS Connect 2604

Simcenter HEEDS Connect 2604 is here, and it's packed with powerful enhancements designed to help engineering teams collaborate seamlessly, explore possibilities together, and make more confident design decisions in real-time, online.

By Hunor Erdelyi, Roberto D'Ippolito

Simcenter HEEDS 2604: Modernized design optimization with AI surrogates, streamlined resource management and enhanced simulation integration

This blog outlines how the latest release from Simcenter HEEDS 2604 accelerates design optimization workflows for engineers working with high...

By Roberto D'Ippolito, Hunor Erdelyi

AWS Partnership

A first for Siemens and AWS – a successful live broadcast at CES 2026!

If you attended this year’s CES you witnessed history in the making. With everything AI these days, no question there...

By Scott Salzwedel

Semiconductor Packaging

HBM3e and HBM4: IC design guide for next-generation high bandwidth memory

HBM3e (High Bandwidth Memory) is the current production-grade high bandwidth memory architecture, delivering over 1.2 TB/s per stack and powering the AI...

Siemens Software Podcast Network

The 5 best FAIR data secrets to empower process engineers

Learn the five secrets of FAIR data and how it will herald the next industrial revolution through digital twins, AI and simulation.

By Shawn Wasserman

Thought Leadership

Shifting left: How Makersite and Siemens enable sustainability by design - Transcript

In this episode of The Industry Forward Podcast, Eryn Devola and Neil D’Souza talk about the partnership between Siemens and...

By Quinn Foster

Solido and AI-powered EDA: TSMC certification, reference flow, and what it all means for advanced node design

Solido's AI-powered EDA tools have earned TSMC certification and a place in the reference flow for A14. Here's what that means for designers working at advanced process nodes.

By Emma-Jane Crozier

Calibre IC Design & Manufacturing

Tackling compute complexity in ESD verification with Calibre

Explore how Calibre PERC and Calibre 3DPERC tackle the escalating compute complexity of ESD verification in advanced IC designs, including 2.5D and 3DIC structures, ensuring robust protection and signoff-quality results

By Calibre IC Design & Manufacturing

Latest podcast episodes

The Industry Forward Podcast

Powering humanoids: the promise and reality of solid-state batteries

August 07, 2026

The future of batteries for humanoid robots will depend on close collaboration across the entire battery ecosystem.

Empowering Engineering Educators

Episode 8: Why Engineering, Why Now?

August 05, 2026

In this thought-provoking episode, host Joe Hanson sits down with guest, science educator Leonisa Aridzzone, to explore the critical importance...

Empowering Engineering Educators

Episode 7: The Engineering Design Process

August 05, 2026

Join host Joe Hanson and MIT Associate Professor Amos Winter for an enlightening exploration of the engineering design process and...