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Expert Insights
Article Roundup: The Calibre Story, Industry 4.0, Electrothermal Analysis, Hardware Emulation, and Thermal Design
May 26, 2017
Calibre Evolves Constantly Is Industry 4.0 Realistic? Face to Face with Siemens CEO Tony Hemmelgarn Electrothermal Analysis of an IC...
By Expert Insights
2
MIN READ
NX Design
Virtual Reality (VR) Has Captured Our Imaginations
May 26, 2017
By Product Manager for NX Rendering @PattiLongwinter Virtual Reality (VR) has allowed me to fly over the Himalayas on my way to visit Mount Everest base camp. An unsettling experience wh...
By Amy Reyes
3
MIN READ
Electronic Systems Design
Going to DAC’2017 in Austin TX? Interested in High Density Advanced Packaging? then read on!!
May 26, 2017
If you’re coming or planning on coming to DAC this June and interested in HDAP such as FO-WLP then you...
By Keith Felton
< 1
MIN READ
Solid Edge
What’s New in ST10: Additive Manufacturing
May 25, 2017
Solid Edge ST10 has added several new things that affect additive manufacturing. 3D Print Page The main menu now has an entry for 3D Print. This page helps you get ready to 3D print on y...
By MLombard
2
MIN READ
Academic and Future Workforce
University of Alabama-Huntsville students wins monthly design contests
May 25, 2017
Thomas Salverson from University of Alabama in Huntsville created his winning image- nine-cylinder Clerget radial engine using Solid Edge. Read what he has to say about his image: ...
By Bijy Vattathara
3
MIN READ
Calibre IC Design & Manufacturing
2017 Will Be B-I-G
May 25, 2017
By Michael White – Mentor, A Siemens Business Trends, plans, and advice on what you can do to succeed.
By Calibre IC Design & Manufacturing
6
MIN READ
Embedded Software
The unknown icon
May 25, 2017
As in all walks of life, the high-tech world has its icons – key people who have been pivotal in...
By Colin Walls
3
MIN READ
NX Manufacturing
Digital Machine Shop Series: Blog #8 Additive Manufacturing
May 25, 2017
3D printing started over 20 years ago but it was limited to soft material and plastic material. What has changed in the past few years is that printers are getting cheaper. Now everybody ...
By Armin Gruenewald
3
MIN READ
Electronic Systems Design
Stop by the Mentor booth at ECTC'2017 and talk HDAP
May 24, 2017
If you’re planning to attend ECTC’2017 next week, then stop by the Mentor booth, #521, to talk with some of...
By Keith Felton
< 1
MIN READ
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Latest podcast episodes
Bugged Out
SDC verification as a first-class asset: A deep dive with Chandu Challapalli
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Harry Foster talks with Chandu Challapalli, Senior Management Director at Siemens EDA, about why timing constraints must be treated as first-class verification assets.
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AI Spectrum
Understanding AI-assisted Chip Design
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Chip design is one of the most complex and challenging tasks in the world, requiring specialized tools and knowledge far...
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How Arizona State University is redefining education and lifelong learning through microcredentials
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Stackable microcredentials are emerging as an essential tool for closing the talent gap at the speed of industrial change.
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