What´s new in Siemens Opcenter Execution Semiconductor 2410

Delivering improved user experience and executional excellence

Summary

Siemens Opcenter™ Execution Semiconductor (OC EX SEMI) is a comprehensive manufacturing execution system (MES) that enables both wafer fabrication factories and assembly and test sites to meet traceability requirements, control production and integrate the shop floor into their enterprise resource planning (ERP) system and extended enterprise. Siemens Opcenter Execution Semiconductor addresses your needs on a configurable, scalable, and modular platform for production.

This release contains 12 enhancements to the WIP Main Simple Mendix UI that provide increased functionality within the user interface, updated Future Hold Matrix UI, introduce Semiconductor and Electronics product synergy, Teamcenter Quality – MES integration along with Core product technology and feature related enhancements.

Benefits

• Continue delivering user interfaces built on the Siemens Mendix Low code platform
• Continuing our transformation of the Opcenter Execution Core product family to implement role-based, process centric, smart user interfaces that will revolutionize the user experience
• Delivers the ability to execute Semiconductor and Electronics MES functionality in a single environment.
• Integration with Teamcenter Quality for upload of non-conformance events and download of inspection plans details to MES

New Opcenter Execution Semiconductor features and enhancements

Mendix Role base user interfaces for improved user experience

The Mendix UIs introduce role-based, process centric user interfaces that use more visual cues and modern techniques to simplify the UIs and implement a smart user experience that guides the user through the proper actions and activities.

WIP Main Simple Mendix UI enhancements

WIP Main Simple enhanced to support the following activities/functionalities

• In-Process split
  • Wafer sampling
    • Sorting
    • Carrier validation
    • In-Line SPC chart display and functions
    • Test program
    • Future lot hold
    • Slot mapping

• Delivers the ability to displays documents through command bar icon

• SPC icon in command bar that allows SPC chart review at TrackOut

New UI notification that informs user that an Eprocedure or Checksheet is required and the user must use portal UI to complete. Checksheet and Eprocedure support coming in future release of WIP main simple.

Future Hold Matrix Mendix UI enhancements

This Mendix UI was updated to align the user experience with the other engineering Mendix UIs.

• Grid aligned to standard Mendix grid UX for grid views functionality, support full and partial text filtering, and includes all criteria in search panel when in List view
  • When adding a new matrix, the slide-out window includes both criteria and details sections
  • Work order criteria field added to matrix

Semiconductor – Electronics synergy

The 2410 release is a technical preview of this capability

• Functionality will provide a solution for vertically integrated manufacturers
• Synergy delivers the ability to execute both Semiconductor and Electronics process model functionality within a single environment.
• There will be some product label name changes in Semiconductor in the 2410 release. These changes segregate differences between Semiconductor and Electronics objects. These changes will have no impact to updates, upgrades, migrations or functionality.

The general availability release of the synergy functionality is planned for 2504.

Teamcenter Quality – Opcenter Execution Semiconductor integration (Phase 1)

Delivers touchpoints between Teamcenter Quality and Opcenter Execution Semiconductor using the active integration gateway (AIG)

Teamcenter Quality to MES

• Inspection definition download via bill of process (BOP) to Electronic Procedures for manual inspection
  • Data collections mapped to a task in the Electronic Procedure
    • Inspection definition download via BOP to the Spec (via transaction map) for automated inspection
      • Data collection mapped to the data collection transaction map on the Spec
        • The OOB configuration example is based on Parent objects. For OC EX Semiconductor MES, the configuration for Semi sub-class objects is required.

MES to Teamcenter Quality

• Escalate a production nonconformance from Opcenter into a Teamcenter Quality issue

For more details, please see the readme information for the Opcenter Connect Integration for Teamcenter (CN4T) 2410 release

New Core technology and features available in Semi

REST API enhancements

Introduces the ability to download files from the shop floor endpoint

• Allows users to retrieve documents in nonconformances via the REST API

Allows for configuring and applying filter tags through a new parameter

Adds support for specifying the ListAction attribute in the REST API payload, providing better control over data management operations

Upgrades the underlying framework from .NET 6 to .NET 8, offering improved performance, security, and compatibility

Single sign-on enhancements

Enables single sign-on when embedding the portal within a third-party application, like supervisory control and data acquisition (SCADA)

Can also directly open a specific page in the portal via a URL and pass in contextual information to that page

• Example: open electronic procedures page and pass in the name of the container

Additional Enhancements

Updates the styling of several portal controls including:

• Active state on buttons
• Toast notifications (application messages)
• Labels on disabled fields
• Asterisk on required fields

Introduces ability to tab into the command bar on portal pages

Enhances transaction trace logging to configure an option to only log errors, not successful transactions when trace logging is enabled

Technology enhancements

Chrome 127+

Edge Chromium 127+

Upgraded Tiny MCE 6.4.2 to 6.8.3

Upgraded to .NET 8.0.5

Upgraded Xerces from 3.2.2 to 3.2.3 in Designer 2

Product release fixes

For the list of PRs addressed, please see the release notes.