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Electronics & Semiconductors

At Siemens we see a symbiotic relationship between Semiconductors and Electronics that drives growth and innovation for both markets: Semiconductors, with their embedded intelligence delivered in rapidly shrinking form factors, representing a rising percent of the value of Electronics systems. Meanwhile, new and innovative categories of smart, connected products and devices are revolutionizing the electronics space, driving strong demand and affinity for innovative designs and products that deliver optimal convenience and entirely new consumer experiences. Design and manufacture of today’s complex products and semiconductor devices requires seamless collaboration across multiple domains including electrical, electronic, mechanical, simulation, software and data management.

Learn more about Siemens solutions for the electronics industry     Learn more about Siemens solutions for the semiconductor industry


Electronic Systems Design

Rigid-Flex Material Considerations

June 28, 2023
Flex and rigid-flex designs refer to a PCB that is partially or entirely constructed using flexible rather than exclusively rigid...
By Patrick Hope
5 MIN READ

Electronic Systems Design

Maximizing Efficiency and Quality: Unlocking the Power of PCBflow DFM Solutions

June 28, 2023
In today’s rapidly evolving electronics manufacturing landscape, efficiency and quality are paramount. Design engineers face the challenge of creating error-free...
By Yaron Tayar
2 MIN READ

Valor

Webinar: For accurate PCB quoting, you need more than Excel

June 28, 2023
Accurate job quoting is key to good business While EMS companies compete for manufacturing jobs, they need to generate quotes...
By Tova Levy
2 MIN READ

Tessent Solutions

Video: System-on-chip ATPG with Tessent SSN

June 26, 2023
Learn how Intel adopted Tessent SSN packet-based ATPG and reduced test time by 34% in this video recorded at the 2023 North America U2U symposium.
By Tessent Solutions
< 1 MIN READ

Tessent Solutions

Video: Developing DFT flow for 3D IC at Broadcom

June 26, 2023
Learn how Broadcom used Tessent Multi-die to build a 3D IC flow in this video recorded at the 2023 North America U2U symposium.
By Tessent Solutions
2 MIN READ

Tessent Solutions

Video: Using defect oriented test to target bridges in automotive designs

June 26, 2023
Learn how NXP achieves zero defects for bridging defects with Tessent's defect oriented test in this video recorded at the 2023 North America U2U symposuim.
By Tessent Solutions
< 1 MIN READ

Tessent Solutions

Video: Break through yield barriers with Siemens and PDF

June 26, 2023
Break through yield barriers with Siemens and PDF Solutions. Watch this video recorded at the 2023 North America U2U symposuim.
By Tessent Solutions
2 MIN READ

Valor

Efficiency is key to more sustainable manufacturing

June 20, 2023
Podcast #3 in our new series with I-Connect007: Sustainability in Electronics Manufacturing As we become more aware of our impact...
By Tova Levy
2 MIN READ


Simcenter

What’s new in Simcenter FLOEFD 2306? | CAD-embedded CFD simulation

June 19, 2023
Explore new features in Simcenter FLOEFD 2306 CAD-embedded CFD incl. power electronics thermal, structural analysis; to new Simcenter FLOEFD for Simcenter 3D, and much more
By Chris Watson, Peter Doughty
10 MIN READ

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