From Manhattan to advanced package design: how Siemens PLM and EDA solutions can help (Part 1 of 2)
In our Manhattan-themed blog, we talked about rising above the limits of semiconductor design using 3D ICs. It’s also the theme for our poster presentation at the upcoming 19th annual Device Packaging Conference (DPC 2023), where we will showcase our latest advancements in PLM and EDA solutions, specifically tailored to meet the challenges of advanced package design.
Siemens PLM and EDA provide solutions for advanced package design
We understand the importance of accuracy, efficiency, and continuous improvement in the semiconductor industry and we believe our solutions can provide tremendous value to advanced package designers.
Our PLM and EDA solutions offer a comprehensive and integrated approach to advanced package design, from product conceptualization to production, with an emphasis on collaboration, simulation, and analysis. With our solutions, designers can virtually represent and test their designs in all dimensions, predict performance with a high level of accuracy, and capture all the information for continuous improvement.
View our poster presentation at the Device Packaging Conference
Learn about the latest advancements in PLM and EDA solutions and how they can help you achieve your advanced package design goals. Join us at the 19th Annual Device Packaging Conference (DPC 2023) and be a part of the future of the microelectronics assembly and advanced packaging industry.
Attend our poster presentation at DPC on Wednesday for the opportunity to see our solutions in action and understand how they can help you overcome the challenges in advanced package design. Our experts will be available to answer any questions and provide demonstrations.
This is the first part in our two-part blog series leading up to the 19th Annual Device Packaging Conference. Stay tuned for part two where we’ll dive deeper into the exciting world of advanced package design and how Siemens PLM and EDA solutions are providing tremendous value to advanced package designers. Whether you’re an industry expert or just starting to explore the field, you won’t want to miss what we have in store.
