How Siemens Cre8Ventures and Roofline’s Edge AI Solution Brings Fire-Power to the Automotive Industry.
As the automotive industry continues to embrace digital transformation, there is a growing need for innovative solutions that streamline AI deployment and enhance the performance of advanced applications. Roofline’s cutting-edge AI deployment software presents a compelling opportunity to address these needs by becoming a Siemens Cre8Ventures Automotive Digital Twin Marketplace partner. This collaboration would not only enrich the capabilities of our cohort but also contribute to the strategic objectives of the EU Chips Act.
Meeting Unmet Needs in the Automotive Industry
Roofline offers a revolutionary software solution that simplifies AI deployment at the edge, making it easier for automotive companies to implement advanced AI models on diverse hardware systems. Traditional methods of deploying AI models often struggle to keep pace with rapidly evolving applications and increasingly diverse and complex hardware ecosystems. Roofline’s platform builds on next-generation compiler technology to address these challenges. It enables the deployment of any AI model from any framework (TensorFlow, PyTorch, ONNX, etc.) on various target hardware systems, including CPUs, GPUs, and AI accelerators.
By joining the Siemens Cre8Ventures PAVE360 Automotive Digital Twin Marketplace, Roofline will bring these capabilities to our ecosystem, providing startups and automotive innovators with a robust toolset to accelerate their route to product. The integration of Roofline’s technology into the Digital Twin Marketplace can significantly reduce time-to-market for automotive solutions, allowing companies to validate and optimize their models virtually before physical production.
Supporting the EU Chips Act Objectives
Roofline’s unique solution aligns with the EU Chips Act’s mission to enhance European semiconductor sovereignty and technological leadership. The ability to deploy AI models efficiently across a wide range of hardware options contributes to reducing Europe’s dependency on non-EU technology and strengthens the local semiconductor ecosystem. Furthermore, Roofline’s flexibility supports the development of innovative applications that leverage Europe’s diverse and growing semiconductor infrastructure.
Through the Siemens Cre8Ventures partnership, Roofline can play a pivotal role in supporting EU Chips Act cohorts by facilitating their route-to-product, route-to-funding, and route-to-market. The PAVE360 Automotive Digital Twin Marketplace, backed by Siemens, provides startups with critical resources, including customer introductions through Siemens’ global World Trade teams and opportunities to delay or mitigate funding needs for initial silicon production. By showcasing their solutions in the Digital Twin environment, startups can offer potential customers and investors a comprehensive view of their products before moving to physical prototypes, thereby enhancing confidence and reducing financial risk.
Enriching the Cohort Capabilities
The integration of Roofline’s advanced AI deployment capabilities will significantly enhance the value proposition of the Siemens Cre8Ventures cohort. Startups within the cohort will benefit from access to Roofline’s SDK, which simplifies AI model deployment with additional features like debugging, tracing, benchmarking, and simulation. This will empower them to optimize their solutions for specific automotive use cases, such as autonomous driving, infotainment or battery management systems.
Moreover, Roofline’s presence in the Digital Twin Marketplace will provide cohort members with a powerful platform to demonstrate their technological prowess to potential customers and partners. By leveraging digital twins, startups can create dynamic simulations of their AI models in real-world scenarios, allowing them to fine-tune their solutions and validate their performance metrics before engaging in costly and time-consuming physical tests.
Conclusion
Roofline’s partnership with Siemens Cre8Ventures and inclusion in the PAVE360 Automotive Digital Twin Marketplace offers a unique opportunity to drive innovation in the automotive industry while supporting the strategic goals of the EU Chips Act. By enabling efficient and flexible AI deployment at the edge, Roofline not only addresses key unmet needs in the automotive sector but also helps to build a more resilient and self-sufficient European semiconductor ecosystem.
We are excited to see how this collaboration will unfold and look forward to the impactful solutions that will emerge from the synergy between Roofline and the Siemens Cre8Ventures community.
For more information about Dream Chip and Siemens’ Cre8Ventures, visit our website or contact Carson Bradbury, Director – EU Chips Act & Co-founder Cre8Ventures (carson.bradbury@siemens.com)
