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Multi-die verification and the chiplet simulation challenge

Multi-die verification: the chiplet simulation challenge

March 16, 2026

When multiple dies, potentially from different vendors and different process nodes, come together in a single package, traditional simulation approaches fall short.

By Emma-Jane Crozier and Pradeep Thiagarajan
3 MIN READ

Meet the Solido Custom IC Team at DAC 2025

June 16, 2025

The Solido Custom IC (CIC) team is gearing up for an exciting presence at DAC 2025, where visitors will discover our innovative AI solutions that are transforming the custom IC landscape.

By Emma-Jane Crozier
3 MIN READ

How Solido’s AI-Assisted Design Optimization Handles Extensive Design Spaces

September 23, 2024

At the Design Automation Conference 2024, I had the opportunity to sit down with Austin Rhodes from Micron Technology at…

By Mohamed Atoua
2 MIN READ

Redefining High-Sigma Verification: Reflections on Presenting AI-Powered Methodologies at DAC 2024

September 12, 2024

This year, I had the privilege of presenting at the 2024 Design Automation Conference (DAC), which took place in San…

By Mohamed Atoua
< 1 MIN READ

Quantum semiconductor research forges ahead with steady breakthroughs

February 2, 2024

Quantum computing is an emerging technology Quantum computing promises a new generation of high-performance computers, with a completely novel approach…

By Pradeep Thiagarajan
4 MIN READ

Exploring production-proven AI-powered EDA solutions with Solido Design Environment

December 7, 2023

Note: If you’re interested in knowing more about Solido Design Environment, check out this executive video by Amit Gupta, VP…

By Mohamed Atoua
2 MIN READ

How AI-powered EDA solutions help design and verify library IP for SoCs

August 29, 2023

Note: If you’re interested in knowing more about the Solido Library IP Solution, check out our on-demand webinar about optimizing…

By Wei-Lii Tan
2 MIN READ