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Verification Horizons

February 2010 Verification Horizons Newsletter Now Available

For those of you who didn’t make it to DVCon this year, you missed one of the things that makes...

By Tom Fitzpatrick

Embedded Software

Technology trends

In last week’s blog I talked about what was going on at Embedded World and made some observations about what...

Simulating the Real World

How much do ‘U-Value’ good thermal insulation? Part VI - revenge of the radiative heat flux

Conduction, the transfer of heat through a solid object. Convection, the transfer of heat in moving air/fluid. Radiation, the transfer...

By Robin Bornoff

Embedded Software

Words on the move

I have written about my interest in language on a previous occasion and commented that I considered myself very lucky...

Embedded Software

EW 2010

Last week I went to Nuremberg [or Nürnberg if you prefer] to attend Embedded World 2010. I have been to...

Verification Horizons

IEEE Standards Meetings in India

EDA & VLSI Standards Focus Meeting on 12 March 2010 As part of its continuing program to reach out to...

By Dennis Brophy

Embedded Software

The AIRpod

I am always interested in new technology, but sometimes I hear about something which particularly catches my imagination and fires...

Simulating the Real World

IC package representation is central to Electronics Cooling

Electronics cooling involves ensuring that IC package temperatures do not exceed maximum rated values. If they do the probability of thermo-mechanical...

By Robin Bornoff

Simulating the Real World

How much do ‘U-Value’ good thermal insulation? Part V

Why is it that when you increase a cavity air gap size beyond ~30mm is there no subsequent detrimental affect...

By Robin Bornoff