Mark your calendar for the 2024 DAC-Chips to Systems Conference

Get ready and mark your calendars for DAC 61 – the Chips to Systems Conference you won’t want to miss! As the ultimate event for all things chips to systems, DAC offers top-notch training, education, exhibits, and unbeatable networking opportunities for designers, researchers, tool developers, and vendors alike. This year, we’re thrilled to announce that Siemens is DAC’s first-ever Diamond Sponsor, shining bright at booth #2521. Siemens is bringing its A-game with an impressive lineup of 64 active participants in the technical program. In this blog post, I’ll spotlight some key Siemens events that you definitely need to check out!

Monday, June 24

• 11:15 AM PDT, DAC Pavilion: Tony Hemmelgarn, CEO of Siemens Digital Industries Software, joins a panel titled “Best of Both Worlds: Bridging the Gaps in Engineering Software for Semiconductors and Systems.” Moderated by Jay Vleeschhouwer, Research Analyst at Griffin Securities, this panel will dive into EDA trends with senior execs from top industrial software companies.
• 2:00 PM PDT, DAC Pavilion: Jean-Marie Brunet, VP and General Manager of Siemens Hardware-Assisted Verification, participates in a panel titled “A New Design Verification Era as Open-Source Upends the Status Quo.” Explore the transformative impact of RISC-V and the open-source ecosystem on semiconductor design and verification, and discuss the future of hardware-assisted verification.

Tuesday, June 25

• 11:15 AM PDT, DAC Pavilion: Juan Rey, VP Government Programs at Siemens, presents an invited TechTalk titled “The Evolution of the Digital Twin in Semiconductor Design, and the Central Role AI Plays.” Discover how Digital Twins have revolutionized semiconductor design, from virtual testing to comprehensive models incorporating AI and Multiphysics, paving the way for closed-loop manufacturing-aware design.
• 2:00 – 2:45 PM PDT, DAC Pavilion: Ed Sperling, Editor-in-Chief at Semiconductor Engineering, moderates the panel “Blackout – Managing kW Power Budgets.” Join Joe Davis, Sr. Director at Siemens, and other experts as they tackle the challenges of managing soaring power budgets in SoCs for AI workloads. Learn about 2.5D and 3D solutions, next-gen VRMs, and the future trajectory of power budgets.

Don’t miss these engaging sessions that blend expert insights with lively discussions! Be sure to explore the entire impressive lineup of Siemens presenters at this year’s DAC – the Chips to Systems Conference, with over 75 papers, posters, and panels in the technical program.

Looking forward to seeing you at this year’s DAC! Be sure to stop by and say “hi!”