Advancing with digital twin and intelligent PCB programming: Siemens and GÖPEL electronic collaboration
At the GÖPEL electronic Test Convention, Siemens and GÖPEL electronic showcased how close collaboration is helping manufacturers address key challenges in modern SMT manufacturing.
As product complexity increases and production cycles accelerate, electronics manufacturers must improve quality while reducing time-to-market. Yet many still rely on fragmented workflows for PCB-A programming and inspection preparation, leading to inefficiencies, manual rework, and delayed production readiness.
Connecting design, planning, and inspection
To overcome these challenges, manufacturers are turning to integrated digital solutions powered by a comprehensive digital twin. By connecting product design, process planning, and shop floor execution, companies can achieve first-time-right production, reduce errors, and eliminate disconnected data flows.
This transformation is especially critical in surface mount technology (SMT) environments, where speed and accuracy in process preparation directly impact yield, quality, and overall efficiency.
Transforming AOI programming with Process Preparation X (PPX)
At the event, Siemens presented Process Preparation X Essentials in collaboration with GÖPEL electronic, demonstrating how digital twin technology is transforming SMT programming and Automated Optical Inspection (AOI).
By integrating PPX with GÖPEL’s AOI systems and leveraging standardized formats such as ODB++, manufacturers can enable seamless data exchange across the value chain. This allows for:
- Verification and adaptation of a test program, even without an existing PCB-A
- Streamlined and automated PCB-A programming
- Reduced engineering effort and faster setup times
- Improved inspection accuracy and consistency
- A continuous digital thread from design to inspection
The result is a more efficient, scalable workflow that minimizes manual intervention and accelerates production ramp-up.
Towards intelligent, AI-driven PCB preparation
Looking ahead, the next step in SMT manufacturing is intelligent automation. Innovations such as AI-driven PCB data preparation are enabling manufacturers to reduce manual processes and further increase precision.
By combining digital twin capabilities with AI-driven insights, manufacturers can optimize process preparation, improve quality, and scale operations across lines and sites.
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