Siemens Spotlights Process Preparation X & Digital Twin Composer at NVIDIA GTC Berlin

Explore the recap of Siemens at NVIDIA GTC in Berlin from October 20-22, 2026, NVIDIA’s premier European AI conference. At the event, Siemens announced its latest collaboration with NVIDIA, combining Teamcenter software and Process Preparation X and NVIDIA Cosmos to advance PCB inspections from design to the factory floor. Electronics manufacturers will be able to create and optimize AI-powered workflows for automated optical inspection (AOI) processes and work with a virtual “golden board” using the digital twin. In addition to accelerating PCB inspection, Siemens also highlighted its vision for the Industrial Metaverse through Digital Twin Composer, illustrating how AI-powered digital twins can bridge the gap between physical and virtual operations, helping manufacturers make smarter decisions, reduce risk, and bring products to market faster.

The future of Electronics Manufacturing is built on connection

Discover how connected manufacturing planning bridges the gap between engineering and production to help electronics manufacturers accelerate readiness and navigate increasing complexity. Join the ZNT and Siemens teams at EFX Stuttgart from October 6–8, 2026, to explore AI-enabled workflows and digital continuity across the product lifecycle.

Advancing with digital twin and intelligent PCB programming: Siemens and GÖPEL electronic collaboration

At the GÖPEL electronic Test Convention, Siemens and GÖPEL electronic showcased how close collaboration is helping manufacturers address key challenges in modern SMT manufacturing. Learn how integrated digital solutions, powered by a comprehensive digital twin, connect product design, process planning, and shop floor execution to achieve first-time-right production and eliminate disconnected data flows.

Two professionals, a woman and a man, collaborate while looking at a tablet with digital overlays of phones, against a blurred background of an SMT manufacturing facility with blue digital lines indicating connectivity.

It’s a partnership, not just a sale in SMT manufacturing

In the evolving SMT manufacturing landscape, successful implementation and optimization of solutions are as crucial as selecting the right technology. Siemens’ Process Preparation X offers not just a solution, but also expert guidance and long-term partnership, ensuring manufacturers can effectively integrate AI and automation while leveraging human expertise for continuous improvement and sustained value.

A computer monitor displaying intelligent SMT Manufacturing data, specifically a detailed PCB layout with various components and design elements visible on the screen

Turning “Ugly” Gerbers into intelligent SMT Manufacturing data

Production efficiency in SMT manufacturing is often hindered by incomplete or outdated input data, a common issue with legacy PCB designs. Siemens’ Process Preparation X offers a solution by transforming fragmented Gerber files into structured, usable manufacturing data, enabling automated SMT and PCB programming even from challenging inputs.

Technology meets quality: from PCB design to electronics manufacturing excellence

Join Siemens and GÖPEL electronic at Test Convention 2026 In today’s electronics manufacturing landscape, quality and efficiency are no longer…

Image of an electronics circuit board with text for APEX EXPO 2026

APEX EXPO 2026: Experience the future of electronics manufacturing with Siemens

The electronics manufacturing industry is transforming rapidly, driven by digitalization, automation, and the fusion of the real and digital worlds….

Simplify Process Preparation with SaaS: Live at Productronica 2025

Every second counts in electronics manufacturing and precision makes the difference between success and costly rework. As new product introduction…

Design AOI processes smarter with Digital Twins

Join our experts to learn how Digital Twin and AI modeling enable faster, smarter AOI test development – even before…