Sign In
Skip to content

Main Navigation

Blogs
  • Products
    • All Products
    • AMS Verification
    • Additive Manufacturing Software
    • Aprisa
    • Capital
    • Catchbook
    • Design with Calibre
    • EDA Consulting Services
    • Fibersim
    • HLS Design & Verification Blog
    • HyperLynx PCB Analysis
    • JT
    • Mendix
    • MindSphere
    • NX Design
    • NX Industrial Electrical Design
    • NX Manufacturing
    • Opcenter
    • PADS Desktop PCB Design
    • PCBflow
    • PLM Components
    • Polarion
    • Questa
    • Semiconductor Packaging
    • Service Lifecycle Management
    • Simcenter
    • Solid Edge
    • Teamcenter
    • Teamcenter Manufacturing
    • Tecnomatix
    • Tessent Solutions
    • Valor
    • Valor DFM Solutions
    • Xpedition Enterprise Blog
  • Industries
    • Aerospace & Defense
    • Automotive & Transportation
    • Consumer Products & Retail
    • Electronics & Semiconductors
    • Energy & Utilities
    • Heavy Equipment
    • Industrial Machinery
    • Marine
    • Medical Devices & Pharmaceuticals
  • Podcasts
    • All Podcasts
    • 3D IC
    • AI Spectrum
    • Additive Manufacturing Podcast
    • Automotive E/E Systems Revolution Podcast
    • Digital Powers Flexible: Consumer Products Podcast
    • Digital Transformation Podcast
    • Energy Transformation Podcast
    • Engineer Innovation Podcast
    • Innovation in the Classroom Podcast
    • Model Based Matters
    • Next Generation Design Podcast
    • Startups: Digitalization to Realization Podcast
    • Talking Aerospace Today Podcast
    • The Future Car Podcast
    • The Voice of Smart Digital Manufacturing Podcast
    • Where Today Meets Tomorrow Podcast
  • Thought Leadership
    • Thought Leadership Blog
    • Embedded Software
    • Expert Insights
    • Simulating the Real World
    • Verification Horizons
  • Corporate
    • Corporate Blog
    • Academic
    • Partners
    • Realize LIVE
    • Small & Medium Business
    • Xcelerator
    • Xcelerator Academy
  • Community
  1. Thought Leadership
  2. Simulating the Real World

thermal resistance

IC package representation is central to Electronics Cooling

IC package representation is central to Electronics Cooling

March 4, 2010

Electronics cooling involves ensuring that IC package temperatures do not exceed maximum rated values. If they do the probability of thermo-mechanical…

By Robin Bornoff
2 MIN READ
So, you want to predict component temperatures do you? Part II

So, you want to predict component temperatures do you? Part II

October 12, 2009

Lumped block package representation makes the best use of limited available data to simulate for an ‘indication’ of case temperature….

By Robin Bornoff
2 MIN READ
Thermatrons Must Leave

Thermatrons Must Leave

August 19, 2009

Talk to a mathematician about thermodynamics and heat transfer and before long they’ll be showing you lots of weird symbols…

By Robin Bornoff
3 MIN READ