Siemens Digital Industries Software Blog Network

Siemens Digital Industries Software Blogs

Semiconductor Packaging

Chip packaging explained: From IC packaging basics to advanced 2.5D and 3D IC technologies

Understanding the evolution and importance of chip packaging As semiconductor innovation pushes the boundaries of performance and power efficiency, chip...

By John McMillan

NX X | How to | Create drawings in NX X Essentials : part two

Creating professional, precise drawings is essential for communicating design intent clearly and effectively. With NX™ X Design Essentials Add-on software,...

By Akos Owusu-korkor, Jamie Tyler

Hybrid electric vehicles architecture and energy management: hofer powertrain´s revolutionary approach

In the pursuit of more fuel-efficient, higher-performance, and sustainable mobility solutions, hofer powertrain has developed a dedicated methodology to optimize...

By Romain Nicolas

Thought Leadership

The recipe for accelerated pharma innovation

The pharmaceutical and life sciences industries have come a long way since the herbal remedies of the Middle Ages and...

By Victoria Carlos

Realize LIVE: Digital Transformation, delivered.

Realize LIVE Americas 2025: that’s a wrap! Realize LIVE Americas 2025 is now finished. Save the dates for 2026, same...

Adopting a digital ship construction strategy – Part 2: Perfect your manufacturing plan before production begins

Disconnected planning slows progress and drives up costs. Especially in shipbuilding, where complexity is the norm. In this series, we...

By Jalisha Henry

Industrial Machinery

Manufacturing process improvements you can make by leveraging data

Manufacturing efficiency is a margin, not just a metric, for machine component manufacturers. Manufacturing process improvements directly translate to higher...

By Veronica Drake, Jason Meyers

Electronics & Semiconductors

Achieving manufacturing excellence in 3D IC design

The semiconductor industry is undergoing a pivotal evolution, fueled by the adoption of 3D IC and innovative packaging technologies. Achieving...

By John McMillan

Siemens and Arm work together to build Digital Twin solutions for AI-Defined Vehicle

PAVE360 digital twin solution gives developers access to virtual models of Arm® automotive IP in the cloud, including the new...

By Heather Campbell

Latest podcast episodes

The Industry Forward Podcast with Dale Tutt

Ep 30 - The Shift-Left in Supply Chain with Richard Barnett - Part 2

December 19, 2025

Welcome to the Industry Forward Podcast with Dale Tutt, the show where we examine industry and technology trends with the...

FutureCast 2026 — Part 2: Specialization, power, and intelligent verification

December 16, 2025

In Part 2 of the special FutureCast 2026 holiday series, Harry Foster continues exploring how the semiconductor landscape is rapidly changing — and why the next phase of innovation will be shaped as much by constraints as by breakthroughs.

What agentic AI means for the design process

December 12, 2025

As it continues to develop, artificial intelligence is starting to be applied across many different sectors of industry with equally...

By Spencer Acain