Siemens Digital Industries Software Blog Network

Siemens Digital Industries Software Blogs


EDA Support Blogs

Redefining Adaptability: Tessent Vector Callbacks for Superior Semiconductor Test Customization

In the rapidly evolving field of semiconductor testing, the ability to adapt and optimize test strategies is crucial for achieving...

Electronic Systems Design

ECAD/MCAD collaboration is no longer optional — it’s survival 

In this episode of the Printed Circuit Podcast, host Steph Chavez welcomes two long-time friends and PCB design veterans —...

Partners

Customize AI to work the way you do

Introduction AI tools such as ChatGPT, Claude, Copilot, Gemini, and others are now embedded in daily work. They’re used to...

Consumer Products & Retail

Avoid the headaches of downtime with lean manufacturing strategies 

Unplanned downtime is silently draining profitability from consumer packaged goods (CPG) manufacturers. Every minute of halted production can lead to missed delivery...

Electronic Systems Design

Etch effects exposed: discover where your copper really goes

Etching inner layers involves cleaning the copper on both sides of the piece of laminate, applying a photoresist, exposing the photoresist to create the inner layer pattern, developing the resist, etching away the unwanted copper, and removing the etch resist. This process is automated in most shops and the chemistry is automatically monitored. As a result, the accuracy and repeatability is quite good. It is possible to etch inner layer traces using this process to an accuracy of ±0.5 mils. This accuracy control helps keep impedance within the tolerances required for transmission lines.

Siemens Software Podcast Network

SDC verification as a first-class asset: A deep dive with Chandu Challapalli

Harry Foster talks with Chandu Challapalli, Senior Management Director at Siemens EDA, about why timing constraints must be treated as first-class verification assets.

Digital Logistics

Designing resilient supply chains with a Digital Twin: Insights from BSH Home Appliances Group

Designing a global supply chain requires balancing cost, service levels, resilience and sustainability. For BSH Home Appliances Group (BSH), achieving...

Semiconductor Packaging

Thermal management in 3D IC: Challenges, modeling and design strategies 

You are likely here because thermal issues have become the primary constraint shaping your 3D IC design decisions. As 3D integration pushes more performance into smaller footprints, thermal...

Energy & Utilities

Visit Siemens at the Energy HPC & AI Conference in Houston from February 24–26

Learn three ways your businesses can use digitalization and simulation to drive dramatic improvements in your engineering efficiency and operations.