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Semiconductor Packaging
Data, data, everywhere: Where did it come from, who owns it and is it the right version?
March 10, 2026
Knowing what is in your IC package design, where it came from, and who touched it last and when, is key to being able to verify with complete certainty and traceability your design's current status.
By Keith Felton
2
MIN READ
Designcenter
Rethinking CAD design: Why flexibility is critical for engineering success
March 10, 2026
The world of engineering and CAD design is rapidly evolving: products are getting more complex; tools vary across engineering specialties and teams are distributed. The challenge is no longer about designing...
By Amy Varghese
5
MIN READ
Cre8Ventures (Siemens EDA)
MemStera Joins the Siemens Cre8Ventures Digital Twin Marketplace to Advance Sovereign AI and Autonomous Systems
March 10, 2026
Siemens Cre8Ventures is pleased to announce that MemStera has joined the Siemens Cre8Ventures Digital Twin Marketplace. This collaboration strengthens Europe’s...
By Carson Bradbury
3
MIN READ
Cre8Ventures (Siemens EDA)
Durance AI Joins the Siemens Cre8Ventures Digital Twin Marketplace
March 10, 2026
We are pleased to announce that Durance AI has joined the Siemens Cre8Ventures Digital Twin Marketplace. Durance AI is developing...
By Carson Bradbury
2
MIN READ
Calibre IC Design & Manufacturing
ICYMI: Siemens EDA at 2026 SPIE Advanced Lithography + Patterning
March 09, 2026
Read about Calibre Manufacturing’s highlights from the 2025 SPIE Advanced Lithography Patterning symposium.
By Calibre IC Design & Manufacturing
5
MIN READ
Thought Leadership
The importance of flexibility in AI chip design podcast - Transcript
March 09, 2026
AI is not a one size fits all solution for approaching industrial problems, rather, it’s important to tailor different models...
By Spencer Acain
7
MIN READ
Siemens Software Podcast Network
The importance of flexibility in AI chip design
March 09, 2026
AI is not a one size fits all solution for approaching industrial problems, rather, it’s important to tailor different models...
By Spencer Acain
< 1
MIN READ
Teamcenter
Life after Oracle Agile PLM | Teamcenter + Supplyframe
March 09, 2026
Teamcenter + Supplyframe bring Design-to-Source Intelligence into PLM Oracle Agile PLM is scheduled to reach its end-of-life by December 2027....
By Will Haines
4
MIN READ
Simcenter
Making every drop count: How simulation continues to address today’s vehicle water management challenges
March 09, 2026
The text alert from Suffolk County Water Authority was very clear… “WE NEED YOUR IMMEDIATE HELP TO CONSERVE WATER! Refrain from...
By James Masters, Behrouz Takabi, Davide Basso
11
MIN READ
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Latest podcast episodes
The Industry Forward Podcast
A devastating surprise industries see with AI integration
July 15, 2026
Industrial AI integration cannot ignore operational technology (OT) and information technology (IT).
By Shawn Wasserman
< 1
MIN READ
3D IC
From silos to system: Sujit Sharan on the cultural and technical shift 3D IC demands
July 15, 2026
“The first call would be for all our EDA partners to shift from a tool-centric thinking to a system level...
By Tova Levy
2
MIN READ
Printed Circuit Podcast
Proactive BOM analysis: Turning supply chain risk into competitive advantage
July 14, 2026
What if the part you approved in five minutes ends up costing your company ten million dollars down the line?...
By Tova Levy
2
MIN READ