Thought Leadership

IESF Automotive 2017: EE Architecture, Autonomous, Connectivity, Electrification

By Expert Insights

Registration for IESF Automotive 2017 is almost full! The event is expected to have record-high attendance. Integrated Electrical Solutions Forum (IESF) Automotive is the leading conference on EE design trends and solutions in the automotive industry. This year’s event will be held at the Inn at St John’s in Plymouth, Michigan on Wednesday September 20th.  Admission is free and includes a mixture of keynotes, guest speakers, technical breakout sessions, panels, solutions expo, and networking events.

The agenda focuses on four key technical areas:

  1. EE Architecture – EDS design, wire harness engineering, networking, and system implementation
  2. Autonomous – Autonomous driving and driver assist systems
  3. Connectivity – Connecting car, driver, and the external world
  4. Electrification – Electric vehicles and supporting technology



The Future of Human Transportation
Bob Lutz, President, Lutz Communications

The former General Motors executive is an expert consultant and best-selling author. Bob’s books, speakings, and consultations are rooted in years of experience in the automotive industry, along with proven business success.


Discontinuities in Automotive EE Design
Wally Rhines, CEO, Mentor, a Siemens Business

During Wally’s tenure, Mentor has grown the industry’s number one market share solutions in four of the ten largest product segments of the EDA industry, while building leading industry positions in areas outside of traditional EDA, including system design, embedded software, automotive and hardware emulation.


The Hansen Report Live
Paul Hansen, The Hansen Report

In his 9th appearance at IESF, Paul will give his insights on the global automotive electronics industry. Paul writes and publishes The Hansen Report on automotive electronics.


The conference program features 40+ technical sessions. You can view the full agenda here.


Electrifying the Digital Thread
The electrical domain architects, integrates and interconnects subsystems within their mechanical host. Increasing functionality, market trends, and the megatrends of electrification and autonomous operation are driving ever more complexity, cost and errors into the process. Today’s advanced solutions create a digital thread connecting all Capital abstractions from product definition through physical design, manufacturing and maintenance, truly electrifying the digital twin.


Autonomous Drive: Systems Design Trade-offs for Centralizing the Sensor Processing
Autonomous driving is making headlines, and the number of players is ever increasing. There are many design considerations for autonomous vehicles because of complexity. Wiring and network tradeoffs need to be evaluated early in the design to help optimize cost, network bandwidth, and functional complexity.


Ethernet and AUTOSAR Today and the Future
Mentor AUTOSAR is spreading as an industry-standard mechanism for ECU design information exchange, and design methodology. This session looks at current production Ethernet and AUTOSAR examples, and the future trends with Adaptive AUTOSAR, and support for a wide range of ECU design and vehicle network technologies


How Electrification of the Powertrain is Revolutionizing Design Processes and Tools
Powertrain electrification is being driven by regulatory and market demands, creating specific challenges in the design process. This presentation will discuss these demands and how they are impacting the future of the automotive industry.


Who Attends IESF Automotive?

  • EE design engineers and managers from OEMs and suppliers
  • Executives looking to optimize their EE design strategies
  • IT professional experts looking to level up their solution knowledge
  • Industry press and analysts


Why Should You Attend IESF Automotive?

  • Invaluable learning opportunity
  • Quality time with experts
  • Peer-to-peer networking


Admission is free, but there are limited seats left. Register here today!

Leave a Reply

This article first appeared on the Siemens Digital Industries Software blog at