Tech Highlights: Emulation, Automotive, Healthcare IoT, Reliability Tests and More
- Emulation Takes on Post-silicon Validation with an Integrated Approach
- Automotive Technology Trends Reshaping an Industry
- A Reliability Checklist for the Connected World
- Healthcare IoT: Promise and Peril
- A New Power-Cycling Strategy for Testing the Reliability of Power Electronics Modules
Emulation Takes on Post-silicon Validation with an Integrated Approach
Embedded Computing Design
For compute-intensive SoC designs, emulation is playing a bigger role in bridging the gap between pre-silicon verification and post-silicon debug environments. Mentor’s Jean-Marie Brunet has the details.
Automotive Technology Trends Reshaping an Industry
Semiconductor Engineering
The automotive industry is being disrupted as never before in its history. But it’s not just about self-driving cars… Two other major technology trends are electrification and connectivity. Brian Derrick, Mentor Graphics VP of Marketing, elaborates on these trends and what they mean for OEMs and technical software companies.
A Reliability Checklist for the Connected World
Tech Design Forum
To support the connected world in PCB design and manufacturing, today’s PCB design tools are reliability-oriented, providing an array of tools and capabilities to improve design success. This article describes 12 technologies that can increase the reliability of your design flow.
Healthcare IoT: Promise and Peril
Semiconductor Engineering
The medical IoT market is gaining momentum, but at a much slower pace than consumer markets. Devices must be secure and ultra-reliable all while juggling regulations, legal liability, and added design costs. Industry experts, including Mentor’s Carey Robertson, elaborate on the state of medical IoT and why it’s a difficult market to tap.
A New Power-Cycling Strategy for Testing the Reliability of Power Electronics Modules
Battery Power Online
The power cycling strategy chosen for high-power semiconductor devices, such as power transistors, diodes, MOSFETs, and IGBTs, during reliability tests can have a significant effect on predicted lifetime results. Dr. John Parry from Mentor Graphics describes how a new method that combines thermal resistance measurements with structural testing can provide more accurate results in less time for predicted lifetime operation than commonly used methods.
