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Electronics & Semiconductors

At Siemens we see a symbiotic relationship between Semiconductors and Electronics that drives growth and innovation for both markets: Semiconductors, with their embedded intelligence delivered in rapidly shrinking form factors, representing a rising percent of the value of Electronics systems. Meanwhile, new and innovative categories of smart, connected products and devices are revolutionizing the electronics space, driving strong demand and affinity for innovative designs and products that deliver optimal convenience and entirely new consumer experiences. Design and manufacture of today’s complex products and semiconductor devices requires seamless collaboration across multiple domains including electrical, electronic, mechanical, simulation, software and data management.

Learn more about Siemens solutions for the electronics industry     Learn more about Siemens solutions for the semiconductor industry


Semiconductor Packaging

Navigating signal integrity and power integrity (SI/PI) in 3D IC design​

August 19, 2025
Q: Is dedicated SI/PI analysis still necessary in 3D IC design? A: With the rapid advancements in chip design automation...
By John McMillan
11 MIN READ

Semiconductor Packaging

IC package thermal resistance: Accurate modeling for system-level IC thermal reliability

August 19, 2025
As semiconductor devices grow more powerful and complex, effective thermal management has become a top priority in IC design. With...
By John McMillan
6 MIN READ

Thought Leadership

Shift-Left with the Digital Twin: A New Era of Software-Defined Products – Part 3

August 18, 2025
The Industry Forward Podcast explores the shift-left: join host Conor Peick and Siemens Vice President Dale Tutt as they kick off a new series focused on the transformative concept of the shift-left with comprehensive digital twin technology.
By Conor Peick
3 MIN READ

Electronic Systems Design

Copper thickness: Closing the knowledge gap to design success

August 13, 2025
Copper thickness determination of rolled and electro-deposited (ED) copper foil by weight provides far more accuracy than contact-thickness gauges. Since the topography of treated foil varies greatly, and since the density of copper is known, weighing a 1-by-1 foot sheet is the best way to determine the average thickness of a sheet of copper.  So formally, the unit that we refer to as “ounces” is actually ounces per square foot.
By Bill Hargin
5 MIN READ

Thought Leadership

EDA and the Shift-Left with Mike Ellow - Part 3 - Transcript

August 13, 2025
EDA and the Shift-Left explored in first discussion of the latest season of the Industry Forward Podcast. Dale Tutt and Conor Peick are joined by Mike Ellow, CEO of Siemens EDA! Mike shares his insights on the transition to software-defined products and systems, the shift-left of engineering processes, and the increasing need for the integration of EDA and semiconductor development into the creation of complex systems like airplanes, cars, and more.
By Conor Peick
8 MIN READ


NX Design

Designcenter X NX Web Editing: Design wherever engineering happens 

August 13, 2025
What if you could access and edit Designcenter X NX designs from anywhere — without needing to install software or...
By Akos Owusu-korkor, Brian Massey
3 MIN READ

Simcenter

3 essential questions answered: How to combine NVH, power or even high voltage zone data

August 11, 2025
🚀 Introduction As the electric vehicle (EV) revolution gains momentum, testing engineers face a dual challenge: ensuring mechanical integrity while...
By Mathieu Sarrazin
6 MIN READ

Semiconductor Packaging

The Missing Piece for Chiplet Success

August 11, 2025
Chiplets are revolutionizing the semiconductor industry, enabling unprecedented levels of integration, performance, and flexibility. By breaking complex designs into smaller,...
By Tova Levy
2 MIN READ

Thought Leadership

Shift-Left with the Digital Twin: A New Era of Software-Defined Products – Part 2

August 08, 2025
The Industry Forward Podcast explores the shift-left: join host Conor Peick and Siemens Vice President Dale Tutt as they kick off a new series focused on the transformative concept of the shift-left with comprehensive digital twin technology.
By Conor Peick
4 MIN READ

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