Multi-Domain Collaboration in the Digital Enterprise
System-level product optimization requires that teams across all disciplines of product development collaborate efficiently; this includes the mechanical, electronic, and electrical domains.
This approach runs counter to the conventional ‘black box’ design process in which teams are largely autonomous from each other, coming together only at the end to validate the total system. Even when such teams try to collaborate during the design process, they face barriers such as tool incompatibility, a lack of a common review platform, and inconsistent system constraints.
![](https://blogs.sw.siemens.com/wp-content/uploads/sites/53/2018/06/MDC2-520x292.jpg)
But there is a solution! Did you know:
- Complex hardware systems can be managed, even those with multiple boards and connections through connectors and cables?
- Cabling can be defined between boards and to external electro-mechanical elements like sensors and actuators?
- Cabling can be integrated bi-directionally with MCAD, enabling accurate definition of signal paths and optimization of size and weight?
At this year’s PCB Forums, we demonstrated how multi-domain collaboration enables ECAD, MCAD, and cabling design teams to optimize electronics systems. Showcased were the abilities to define functional system models from requirements, partition them into optimized EE architectures, then co-design each of the domains within integrated environments.
If you missed this year’s PCB Forums or want to revisit the presentations you saw, you’re in luck!
The presentation covering Multi-domain Collaboration In The Digital Enterprise is now available to view. Just click below!