Helping your IC Packaging journey become a productive Xpedition…
Recently our Xpedition IC Packaging VX.2.11 was released, bringing significant new features, capability, and enhanced usability to an already powerful platform. See the recent blog post by our colleague John McMillan for more specifics about how you can use the platform to accelerate design!
But did you know that Siemens EDA also offers consulting services that can help you formulate a best practice- based Xpedition based IC packaging methodology?
Did you know that our consulting services have helped numerous customers boost their productivity using Xpedition in IC packaging (as well for PCB design and analysis)?
Did you know that we can even execute IC packaging workflows for you, performing elements such as interposer design, PDK conversion, and SI/PI, stress, and thermal analyses?
If you’d like to know more – we invite you to visit our new, updated Systems services webpage, where you’ll find:
Our latest info brief, which contains more detail about our IC Packaging service offerings!
The IC Packaging Services theatre, where Bill Acito, our key IC Packaging Consultant, gives his experience-based insights on the benefits of using Siemens EDA Consulting for your packaging projects!
Stay tuned – good things are happening for IC Packaging design with Xpedition!
And… there’ll be more to come!
-The Siemens EDA Consulting Services Team
