Self-verifying, long-running EDA AI agents that engineers can trust

At DAC 2026, we announced self-verifying, long-running EDA AI agents for semiconductor and PCB design, in collaboration with NVIDIA.

AI in EDA: Practical advice, no matter where you are on the journey

Curious about AI in EDA? Discover how to seamlessly integrate AI by pinpointing problems, testing incrementally, collaborating with vendors and measuring impact.

Library characterization takes too long – here’s how Solido Characterizer uses AI to change that

Discover how Solido Characterizer uses AI to deliver 7x faster library characterization — turning weeks of runtime into days without sacrificing accuracy.

Using Data And AI More Effectively In EDA

The semiconductor industry is at a pivotal moment, with the increasing complexity of designs demanding innovative approaches to efficiency and…

Agentic IC design panel discussion at Solido Custom IC Forum

Is Agentic IC Design the Next Big Thing? Industry Experts Answer

Industry leaders reveal how agentic IC design is transforming chip development. Discover adoption trends, benefits & challenges.

EDA AI panel at the 2025 Siemens EDA User2User conference in Santa Clara, CA. Panelists (from left to right): Ting Ku (Nvidia), Ken Dyer (Microsoft), Karan Singh (AWS), Andrew Ross (AMD), Dan Yu (Siemens EDA), and Jeff Dyck (Siemens EDA).

Blueprint for Achieving Excellence in EDA using AI: Industry Experts Weigh In

This engaging Siemens EDA panel on AI implementation highlighted several key points: AI will enhance human expertise in EDA; while rich EDA data is crucial, it also poses challenges; robust compute infrastructure is essential for AI-driven EDA systems; and the adoption of AI should be swift yet stable