Accelerating TRNG Verification: Microsoft-Siemens EDA Breakthrough Simulation Methodology at DAC 

From 1.5-year simulation bottlenecks to verification in days, Microsoft and Siemens EDA’s collaboration eliminates one of the biggest roadblocks in hardware security verification.

Agentic IC design panel discussion at Solido Custom IC Forum

Is Agentic IC Design the Next Big Thing? Industry Experts Answer

Industry leaders reveal how agentic IC design is transforming chip development. Discover adoption trends, benefits & challenges.

Accelerating Digital Design: New Library Generation and Analysis Flows from Google-Siemens EDA Collaboration at DAC

From rapid library generation to precise analytics, Google and Siemens EDA’s latest collaboration presented at DAC tackles some of the biggest challenges in mobile SoC development.

Meet the Solido Custom IC Team at DAC 2025

The Solido Custom IC (CIC) team is gearing up for an exciting presence at DAC 2025, where visitors will discover our innovative AI solutions that are transforming the custom IC landscape.

Siemens’ Solido Custom IC and TSMC Collaborate to Enable Advanced Process Node Verification

After an extensive qualification process, Analog FastSPICE (AFS), part of Solido Simulation Suite, has achieved certification for TSMC’s N2P and A16 process nodes. Solido SPICE also achieved qualification for these technology nodes, meeting TSMC’s accuracy requirements.