Solido Custom IC Innovation at Intel Foundry Direct Connect 2025
The Solido Custom IC team, alongside colleagues from across Siemens EDA, joined ecosystem partners at Intel Foundry Direct Connect 2025 this April in San Jose. At the event, Intel unveiled major advancements across its process and packaging technologies, including Intel 14A, 18A-P, and 18A-PT, along with cutting-edge solutions like Foveros Direct and Embedded Multi-die Interconnect Bridge-T (EMIB-T) . The event highlighted Intel’s growing momentum in their systems foundry strategy, while also marking an important milestone in the Siemens-Intel collaboration. Together, we’re advancing solutions for cutting-edge integrated circuits and advanced packaging technologies, spanning both 2D and 3D IC implementations as highlighted in the press release that coincided with the event.
Our demonstration of the Solido Custom IC Platform at the Siemens EDA booth garnered significant attention from attendees. The steady flow of visitors, ranging from engineers to foundry partners and industry decision-makers, reflected strong market interest in advanced custom IC solutions, especially for leading-edge nodes like Intel 18A.
Visitors were particularly interested in our latest developments, as we highlighted several significant advances in our Intel Foundry collaboration, including:
• Full certification of Solido SPICE and Analog FastSPICE (AFS) for Intel 18A
• Intel 18A process is now enabled with Open Model Interface (OMI) for IC aging modeling and reliability analyses, supported by Solido Simulation Suite
• Integration of Solido Simulation Suite into Intel Foundry’s Custom Reference Flow (CRF)
• Intel 18A-P qualification underway, with early runsets available for Intel 14A-E
The event showcased both Intel’s ambitious roadmap and the robust ecosystem supporting it. As we continue to enhance the Solido Custom IC platform for Intel’s advanced nodes, we invite those who couldn’t attend to connect with us to learn more about our solutions.
